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    Light-emitting device and backlight module thereof
    3.
    发明授权
    Light-emitting device and backlight module thereof 有权

    公开(公告)号：US11474289B2

    公开(公告)日：2022-10-18

    申请号：US17448351

    申请日：2021-09-21

    Applicant: Lextar Electronics Corporation

    Inventor： Lung-Kuan Lai ,  Jian-Chin Liang

    IPC: F21V8/00

    Abstract: The present disclosure proposes a light-emitting device and a backlight module thereof. The light-emitting elements includes a substrate, a plurality of light-emitting elements, a light guide layer, a plurality of first light adjustment patterns, and a plurality of second light adjustment patterns. The light-emitting elements are disposed on the substrate. The light guide layer covers the substrate and the light-emitting elements. The first light adjustment patterns are disposed over or embedded within the light guide layer, and each of the first light adjustment patterns is located above each of the light-emitting elements, respectively. The second light adjustment patterns are disposed on or embedded in the light guide layer, and the second light adjustment patterns surround the corresponding first light adjustment patterns, respectively. The first light adjustment patterns and second light adjustment patterns have a refractive index smaller than that of the light guide layer.

    Light emitting device and light emitting module
    4.
    发明授权
    Light emitting device and light emitting module 有权

    公开(公告)号：US11271371B2

    公开(公告)日：2022-03-08

    申请号：US16984176

    申请日：2020-08-04

    Applicant: Lextar Electronics Corporation

    Inventor： Ting-Kai Chen ,  Lung-Kuan Lai ,  Jian-Chin Liang

    IPC: H01S5/40 ,  H01S5/02255 ,  H01S5/02257

    Abstract: A light emitting device includes an edge emitting laser chip and a reflecting mirror. The edge emitting laser chip has light emitting ports arranged in parallel in a first direction. The light emitting ports emit light beams in a second direction. The reflecting mirror includes a reflecting surface used to reflect the light beams to a third direction. The first, second and third direction are perpendicular to each other. The light beams are emitted to the reflecting surface through the virtual incident plane and project first light spots on the reflecting surface. Each projected light spot has a first axis length in the first direction and a third axis length in the third direction. An interval between two immediately-adjacent light emitting ports is greater than the first axis length of one of the two projected light spots aligned with the two immediately-adjacent light emitting ports.

    Pixel array package structure and display panel
    5.
    发明授权
    Pixel array package structure and display panel 有权

    公开(公告)号：US11367849B2

    公开(公告)日：2022-06-21

    申请号：US16232041

    申请日：2018-12-25

    Applicant: Lextar Electronics Corporation

    Inventor： Hui-Ru Wu ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Lung-Kuan Lai ,  Cheng-Yu Tsai ,  Hsin-Lun Su ,  Ting-Kai Chen

    IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

    Light emitting diode module
    7.
    外观设计
    Light emitting diode module 有权

    公开(公告)号：USD995454S1

    公开(公告)日：2023-08-15

    申请号：US29755332

    申请日：2020-10-20

    Applicant: Lextar Electronics Corporation

    Designer： Ting-Kai Chen ,  Lung-Kuan Lai

    Abstract: FIG. 1 is a front, top, right perspective view of a light emitting diode module showing a first embodiment of our new design;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a left side elevational view thereof;
    FIG. 5 is a right side elevational view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof;
    FIG. 8 is a partial enlarged view thereof, as labeled with symbol 8 in FIG. 1;
    FIG. 9 is a partial enlarged view thereof, as labeled with symbol 9 in FIG. 2;
    FIG. 10 is a front, top, right perspective view of a light emitting diode module showing a second embodiment of our new design;
    FIG. 11 is a front elevational view thereof;
    FIG. 12 is a rear elevational view thereof;
    FIG. 13 is a left side elevational view thereof;
    FIG. 14 is a right side elevational view thereof;
    FIG. 15 is a top plan view thereof;
    FIG. 16 is a bottom plan view thereof;
    FIG. 17 is a partial enlarged view thereof, as labeled with symbol 17 in FIG. 10;
    FIG. 18 is a partial enlarged view thereof, as labeled with symbol 18 in FIG. 11;
    FIG. 19 is a front, top, right perspective view of a light emitting diode module showing a third embodiment of our new design;
    FIG. 20 is a front elevational view thereof;
    FIG. 21 is a rear elevational view thereof;
    FIG. 22 is a left side elevational view thereof;
    FIG. 23 is a right side elevational view thereof;
    FIG. 24 is a top plan view thereof;
    FIG. 25 is a bottom plan view thereof;
    FIG. 26 is a partial enlarged view thereof, as labeled with symbol 26 in FIG. 19; and,
    FIG. 27 is a partial enlarged view thereof, as labeled with symbol 27 in FIG. 20.

    Light-emitting diode device and manufacturing method thereof
    10.
    发明授权
    Light-emitting diode device and manufacturing method thereof 有权

    公开(公告)号：US10720559B2

    公开(公告)日：2020-07-21

    申请号：US16153823

    申请日：2018-10-07

    Applicant: Lextar Electronics Corporation

    Inventor： Lung-Kuan Lai ,  Pei-Song Cai ,  Jian-Chin Liang ,  Hao-Chung Chan ,  Hong-Zhi Liu

    IPC: H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L25/075 ,  H01L33/48

    Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

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