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    Light emitting diode packaging structure
    1.
    发明授权
    Light emitting diode packaging structure 有权

    公开(公告)号：US11949056B2

    公开(公告)日：2024-04-02

    申请号：US18303578

    申请日：2023-04-20

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

    IPC: H01L33/62 ,  H01L33/00 ,  H01L33/58

    CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

    Pixel circuit
    2.
    发明授权
    Pixel circuit 有权

    公开(公告)号：US11495169B2

    公开(公告)日：2022-11-08

    申请号：US17444195

    申请日：2021-08-02

    Applicant: Lextar Electronics Corporation

    Inventor： Chien-Nan Yeh ,  Jian-Chin Liang

    IPC: G09G3/30 ,  G09G3/20

    Abstract: The present disclosure relates to a pixel circuit including a light emitting unit, a processing circuit and a driving circuit. The processing circuit is configured to receive a frame display signal, and is configured to calculate the frame display signal to generate a driving duty cycle corresponding to a driving period according to a driving current value. The driving circuit is electrically connected to the processing circuit and the light emitting unit, and is configured to drive the light emitting unit during the driving period according to the driving duty cycle, the driving current value and a driving frequency.

    Pixel array package structure and display panel
    4.
    发明授权
    Pixel array package structure and display panel 有权

    公开(公告)号：US11367849B2

    公开(公告)日：2022-06-21

    申请号：US16232041

    申请日：2018-12-25

    Applicant: Lextar Electronics Corporation

    Inventor： Hui-Ru Wu ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Lung-Kuan Lai ,  Cheng-Yu Tsai ,  Hsin-Lun Su ,  Ting-Kai Chen

    IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

    Light emitting diode packaging structure and method for manufacturing the same
    7.
    发明授权
    Light emitting diode packaging structure and method for manufacturing the same 有权

    公开(公告)号：US11296269B2

    公开(公告)日：2022-04-05

    申请号：US16944131

    申请日：2020-07-30

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

    IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

    Light-emitting diode device and manufacturing method thereof
    8.
    发明授权
    Light-emitting diode device and manufacturing method thereof 有权

    公开(公告)号：US10720559B2

    公开(公告)日：2020-07-21

    申请号：US16153823

    申请日：2018-10-07

    Applicant: Lextar Electronics Corporation

    Inventor： Lung-Kuan Lai ,  Pei-Song Cai ,  Jian-Chin Liang ,  Hao-Chung Chan ,  Hong-Zhi Liu

    IPC: H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L25/075 ,  H01L33/48

    Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

    LIGHT SOURCE MODULE
    9.
    发明申请
    LIGHT SOURCE MODULE 有权
    光源模块

    公开(公告)号：US20130322067A1

    公开(公告)日：2013-12-05

    申请号：US13709655

    申请日：2012-12-10

    Applicant: LEXTAR ELECTRONICS CORPORATION

    Inventor： Yun-Yi Tien ,  Pei-Song Cai ,  Jian-Chin Liang

    IPC: F21V9/16

    CPC classification number: F21V9/30 ,  F21V9/08 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.

    Abstract translation: 光源模块包括基板，第一照明元件，第二照明元件和第三照明元件。 第一照明元件包括设置在基板上的蓝色LED芯片和覆盖蓝色LED芯片的第一波长转换层，其中从蓝色LED芯片发射的蓝色光可以在第一波长的范围内被转换为光。 第二照明元件包括设置在基板上的蓝色LED芯片和覆盖蓝色LED芯片的第二波长转换层，其中从蓝色LED芯片发出的蓝色光可以转换成第二波长范围内的光。 第三照明元件包括蓝色LED芯片。

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