公开(公告)号：US20150076542A1

公开(公告)日：2015-03-19

申请号：US14197648

申请日：2014-03-05

Applicant: Lextar Electronics Corporation

Inventor： Chia-Ming SUNG ,  Liang-Ta LIN ,  Ching-Yao LIN ,  Sheng-Pei LIN

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L33/56 ,  H01L33/507

Abstract: The present disclosure provides a light emitting module, which includes a base board, a light emitting diode chip, a transparent thermoplastic layer, and fluorescent glue. The base board includes a die-bonding zone. The light emitting diode chip is bonded on the die-bonding zone. The light emitting diode chip includes an upper surface, a lower surface opposite to the upper surface, and a plurality of side surfaces adjoined between the upper surface and lower surfaces. A transparent thermoplastic layer encloses at least one portion of the light emitting diode chip. The fluorescent glue disposed over to cover the base board, the light emitting diode chip, and the transparent thermoplastic layer.

Abstract translation: 本公开提供了一种发光模块，其包括基板，发光二极管芯片，透明热塑性层和荧光胶。 基板包括芯片接合区域。 发光二极管芯片接合在芯片接合区上。 发光二极管芯片包括上表面，与上表面相对的下表面以及与上表面和下表面相邻的多个侧表面。 透明热塑性层包围至少一部分发光二极管芯片。 设置在覆盖基板，发光二极管芯片和透明热塑性层的荧光胶。