公开(公告)号：US20150115308A1

公开(公告)日：2015-04-30

申请号：US14273490

申请日：2014-05-08

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Ching-Yao LIN

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/20 ,  H01L2933/0066

Abstract: The present disclosure provides a light-emitting diode package, including: a carrier; a light-emitting diode chip disposed over the carrier and electrically connected to the carrier, wherein the light-emitting diode chip includes at least two recesses at corners located on a diagonal line of the light-emitting diode chip; a eutectic layer disposed between the light-emitting diode chip and the carrier, wherein the eutectic layer includes at least two metal pillars embedded into the at least two recesses respectively, wherein an upper portion of the metal pillars covers a portion of a top surface of the light-emitting diode chip. The present disclosure also provides a method for manufacturing a light-emitting diode package.

Abstract translation: 本公开提供了一种发光二极管封装，包括：载体; 发光二极管芯片，其布置在所述载体上并电连接到所述载体，其中所述发光二极管芯片包括位于所述发光二极管芯片的对角线上的拐角处的至少两个凹部; 设置在所述发光二极管芯片和所述载体之间的共晶层，其中所述共晶层包括分别嵌入所述至少两个凹部中的至少两个金属柱，其中所述金属柱的上部覆盖所述至少两个凹部的顶部表面的一部分 发光二极管芯片。 本公开还提供了一种用于制造发光二极管封装的方法。

公开(公告)号：US20150062962A1

公开(公告)日：2015-03-05

申请号：US14149065

申请日：2014-01-07

Applicant: Lextar Electronics Corporation

Inventor： Ching-Yao LIN

IPC: F21V8/00

CPC classification number: G02B6/0041 ,  G02B6/003

Abstract: A lighting apparatus includes a lighting element and a light guide plate. The light guide plate includes an optical waveguide zone and a wavelength converting zone. The optical waveguide zone is disposed on the lighting element, and includes an upper total reflection surface, a lower total reflection surface, a light incident surface and a first light outgoing surface. The upper and lower total reflection surfaces are disposed on opposite sides of the optical waveguide zone. The light incident surface is positioned on a partial area of the lower total reflection surface, and positioned on the optical path of the light emitted by the lighting element. The first light outgoing surface connects the upper and lower total reflection surfaces. The wavelength converting zone is adjoined to the first light outgoing surface, and includes a wavelength converting material therein.

Abstract translation: 照明装置包括照明元件和导光板。 导光板包括光波导区域和波长转换区域。 光波导区域设置在照明元件上，并且包括上全反射面，下全反射面，光入射面和第一光出射面。 上下全反射面配置在光波导区的相对侧。 光入射表面位于下全反射面的局部区域上，并位于由照明元件发射的光的光路上。 第一光出射面连接上下全反射面。 波长转换区与第一光出射面邻接，并且在其中包括波长转换材料。

公开(公告)号：US20140118999A1

公开(公告)日：2014-05-01

申请号：US14056503

申请日：2013-10-17

Applicant: Lextar Electronics Corporation

Inventor： Ching-Yao LIN

IPC: F21V13/08 ,  F21V13/12

CPC classification number: F21V13/08 ,  F21K9/62 ,  F21K9/64 ,  F21V13/12 ,  F21Y2115/10

Abstract: A lighting device includes a light bar, two reflective covers and a reflective plate. The two reflective covers respectively connected to two opposite long sides of the light bar. The reflective plate is positioned at the light output side of the light bar. The reflective surface of the reflective plate faces the light output side of the light bar. The reflective plate has a wavelength conversion layer positioned on the reflective surface thereof. The light bar emits a first wavelength light, and a portion of the first wavelength light is converted by the wavelength conversion layer into a second wavelength light which is reflected by the reflective plate to the two reflective covers, while the remaining non-converted first wavelength light is reflected by the reflective plate to the two reflective covers and mixed with the second wavelength lights to give a light with a predetermined spectrum.

Abstract translation: 照明装置包括灯条，两个反射罩和反射板。 两个反射罩分别连接到灯条的两个相对的长边。 反射板位于灯条的光输出侧。 反射板的反射面朝向光条的光输出侧。 反射板具有位于其反射表面上的波长转换层。 光条发射第一波长光，并且第一波长光的一部分由波长转换层转换成由反射板反射到两个反射盖的第二波长光，而剩余的未转换的第一波长 光被反射板反射到两个反射盖并与第二波长光混合以给出具有预定光谱的光。

公开(公告)号：US20150076542A1

公开(公告)日：2015-03-19

申请号：US14197648

申请日：2014-03-05

Applicant: Lextar Electronics Corporation

Inventor： Chia-Ming SUNG ,  Liang-Ta LIN ,  Ching-Yao LIN ,  Sheng-Pei LIN

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L33/56 ,  H01L33/507

Abstract: The present disclosure provides a light emitting module, which includes a base board, a light emitting diode chip, a transparent thermoplastic layer, and fluorescent glue. The base board includes a die-bonding zone. The light emitting diode chip is bonded on the die-bonding zone. The light emitting diode chip includes an upper surface, a lower surface opposite to the upper surface, and a plurality of side surfaces adjoined between the upper surface and lower surfaces. A transparent thermoplastic layer encloses at least one portion of the light emitting diode chip. The fluorescent glue disposed over to cover the base board, the light emitting diode chip, and the transparent thermoplastic layer.

Abstract translation: 本公开提供了一种发光模块，其包括基板，发光二极管芯片，透明热塑性层和荧光胶。 基板包括芯片接合区域。 发光二极管芯片接合在芯片接合区上。 发光二极管芯片包括上表面，与上表面相对的下表面以及与上表面和下表面相邻的多个侧表面。 透明热塑性层包围至少一部分发光二极管芯片。 设置在覆盖基板，发光二极管芯片和透明热塑性层的荧光胶。