公开(公告)号：US20150155451A1

公开(公告)日：2015-06-04

申请号：US14280694

申请日：2014-05-19

Applicant: Lextar Electronics Corporation

Inventor： Zong-Han YU ,  Yi-Lun LIN

IPC: H01L33/52 ,  H01L33/58

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode package structure includes a substrate, a light emitting diode chip and a terminal connecting portion. The substrate has a first surface and a second surface that are opposite to each other, and a side surface surrounding and connecting the first surface and the second surface. The first surface has a predetermined die bonding area and the light emitting diode chip is disposed on the die bonding area. The terminal connecting portion protrudes from the side surface and is electrically connected to the light emitting diode chip.

Abstract translation: 发光二极管封装结构包括衬底，发光二极管芯片和端子连接部分。 基板具有彼此相对的第一表面和第二表面，以及围绕并连接第一表面和第二表面的侧表面。 第一表面具有预定的管芯接合区域，并且发光二极管芯片设置在管芯接合区域上。 端子连接部分从侧表面突出并且电连接到发光二极管芯片。