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公开(公告)号：US20180108817A1
公开(公告)日：2018-04-19
申请号：US15696198
申请日：2017-09-06
Applicant: Lextar Electronics Corporation
Inventor： Cheng-Ping CHANG , Zong-Han YU
CPC classification number: H01L33/507 , F21Y2115/10 , H01L25/0753 , H01L25/13 , H01L33/486 , H01L33/504 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: A white light source device includes a first light-emitting element, and at least one second light-emitting element. The first light-emitting element includes a first light-emitting unit and a first wavelength conversion unit, and emits a first light beam. Each of the second light-emitting elements includes a second light-emitting unit and a second wavelength conversion unit, and emits a second light beam. An emission spectrum of the second light beam is different from an emission spectrum of the first light beam. The first light beam and the second light beam are mixed into a white light beam, and a color fidelity index of the white light beam is greater than 90.
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公开(公告)号：US20150021633A1
公开(公告)日：2015-01-22
申请号：US14243844
申请日：2014-04-02
Applicant: LEXTAR ELECTRONICS CORPORATION
Inventor： Zong-Han YU
CPC classification number: H01L33/642 , H01L25/0753 , H01L33/60 , H01L2224/45144 , H01L2224/48095 , H01L2224/48137 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: An LED package is disclosed, which includes a heat dissipation plate, a composite structure, an LED chip, and an encapsulant. The heat dissipation plate has a chip bonding area, a circuit area, and a first dam disposed at the boundary between the chip bonding area and the circuit area, wherein the first dam is formed by punching or bending the heat dissipation plate. The composite structure is disposed on the circuit area. The LED chip which is disposed on the chip bonding area is electrically connected to the composite structure and covered by the encapsulant. Also a light-emitting device using the LED package is disclosed.
Abstract translation: 公开了一种LED封装，其包括散热板，复合结构，LED芯片和密封剂。 散热板具有芯片接合区域，电路区域和设置在芯片接合区域和电路区域之间的边界处的第一坝，其中通过冲压或弯曲散热板形成第一坝。 复合结构设置在电路区域上。 设置在芯片接合区域上的LED芯片电连接到复合结构并被密封剂覆盖。 还公开了使用LED封装的发光器件。
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公开(公告)号：US20190319175A1
公开(公告)日：2019-10-17
申请号：US15953508
申请日：2018-04-16
Applicant: Lextar Electronics Corporation
Inventor： Cheng-Ping CHANG , Zong-Han YU , Kuo-Chan HUNG
IPC: H01L33/50
Abstract: A white light emitting device includes a blue LED chip having a dominant emission wavelength of about 440-465 nm, and a phosphor layer configured to be excited by the dominant emission wavelength of the blue LED chip. The phosphor layer includes a first phosphor having a peak emission wavelength of about 480-519 nm, a second phosphor having a peak emission wavelength of about 520-560 nm, and a third phosphor having a peak emission wavelength of about 620-670 nm. The first phosphor and the second phosphor both have a garnet structure as represented by A3B5O12:Ce, A is selected from the group consisting of Y, Lu, and a combination of thereof, and B is selected from the group consisting of Al, Ga, and a combination of thereof.
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公开(公告)号：US20150155451A1
公开(公告)日：2015-06-04
申请号：US14280694
申请日：2014-05-19
Applicant: Lextar Electronics Corporation
Inventor： Zong-Han YU , Yi-Lun LIN
CPC classification number: H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting diode package structure includes a substrate, a light emitting diode chip and a terminal connecting portion. The substrate has a first surface and a second surface that are opposite to each other, and a side surface surrounding and connecting the first surface and the second surface. The first surface has a predetermined die bonding area and the light emitting diode chip is disposed on the die bonding area. The terminal connecting portion protrudes from the side surface and is electrically connected to the light emitting diode chip.
Abstract translation: 发光二极管封装结构包括衬底，发光二极管芯片和端子连接部分。 基板具有彼此相对的第一表面和第二表面，以及围绕并连接第一表面和第二表面的侧表面。 第一表面具有预定的管芯接合区域，并且发光二极管芯片设置在管芯接合区域上。 端子连接部分从侧表面突出并且电连接到发光二极管芯片。
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