公开(公告)号：US20240006842A1

公开(公告)日：2024-01-04

申请号：US18344715

申请日：2023-06-29

Applicant: Lextar Electronics Corporation

Inventor： Meng Hsin KUO ,  Ming-Jing LEE ,  Yi-Min CHEN

IPC: H01S5/0232 ,  H01S5/02253 ,  H01S5/028 ,  H01S5/024

CPC classification number: H01S5/0232 ,  H01S5/02253 ,  H01S5/0283 ,  H01S5/02469 ,  H01S5/183

Abstract: A package structure is provided. The package structure includes a substrate, a frame structure, and a lens portion. The frame structure is disposed on the substrate. A sidewall of the frame structure has multiple lamination traces thereon. The lens portion covers the substrate. The frame structure has a through hole passing through the sidewall, and the through hole includes an edge, and a portion of the lamination traces overlaps the edge of the through hole.

公开(公告)号：US20250149851A1

公开(公告)日：2025-05-08

申请号：US18935144

申请日：2024-11-01

Applicant: Lextar Electronics Corporation

Inventor： Yi-Min CHEN ,  Kai-Hung CHENG ,  Ming-Jing LEE ,  Jung-Tang CHU

IPC: H01S5/02255 ,  H01S5/02208

Abstract: A laser module is provided. The laser module includes a substrate, a laser diode and a diffuser. The substrate has a surface and a base plane, wherein the base plane is parallel to the surface. The laser diode is disposed on the surface. The diffuser is disposed above the laser diode, wherein an included angle is formed between the diffuser and the base plane, and the included angle is greater than 5 degrees.