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公开(公告)号:US20250102725A1
公开(公告)日:2025-03-27
申请号:US18893276
申请日:2024-09-23
Applicant: Lextar Electronics Corporation
Inventor: Jia-Jie PAN , Wei-Yi HSU , Jung-Tang CHU , Ming-Jing LEE
IPC: F21V8/00
Abstract: The present pertains to an optical module including an optical shell, a plurality of first light-emitting diodes, a plurality of light guide plates, and a plurality of second light-emitting diodes. The optical shell includes a plurality of recessed portions and a flat portion surrounding the recessed portions. One of the first light-emitting diodes is disposed in the recessed portions. Each of the light guide plates has a top surface and a sidewall, and the top surface of the light guide plate is substantially at the same level as the flat portion of the optical shell. One of the second light-emitting diodes is disposed below the top surface of the light guide plates and is adjacent to the sidewall of the light guide plates.
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公开(公告)号:US20230011488A1
公开(公告)日:2023-01-12
申请号:US17654595
申请日:2022-03-14
Applicant: Lextar Electronics Corporation
Inventor: Ke-Wei LIU , Yen-Chih CHOU , Ming-Jing LEE
IPC: H01L31/173 , H01L31/02 , H01L31/0203 , H01L31/0232
Abstract: A detection device includes a substrate, a light-emitter, and a light receiver. The substrate includes a first surface area and a second surface area, in which the first surface area has a first reflectance greater than a second reflectance of the second surface area. The light emitter is disposed on the first surface area, and the light receiver is disposed on the second surface area. The light receiver has a third reflectance which is substantially the same as the second reflectance of the second surface area.
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公开(公告)号:US20250149851A1
公开(公告)日:2025-05-08
申请号:US18935144
申请日:2024-11-01
Applicant: Lextar Electronics Corporation
Inventor: Yi-Min CHEN , Kai-Hung CHENG , Ming-Jing LEE , Jung-Tang CHU
IPC: H01S5/02255 , H01S5/02208
Abstract: A laser module is provided. The laser module includes a substrate, a laser diode and a diffuser. The substrate has a surface and a base plane, wherein the base plane is parallel to the surface. The laser diode is disposed on the surface. The diffuser is disposed above the laser diode, wherein an included angle is formed between the diffuser and the base plane, and the included angle is greater than 5 degrees.
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公开(公告)号:US20230128068A1
公开(公告)日:2023-04-27
申请号:US18047337
申请日:2022-10-18
Applicant: Lextar Electronics Corporation
Inventor: Ming-Jing LEE
Abstract: An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.
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公开(公告)号:US20240006842A1
公开(公告)日:2024-01-04
申请号:US18344715
申请日:2023-06-29
Applicant: Lextar Electronics Corporation
Inventor: Meng Hsin KUO , Ming-Jing LEE , Yi-Min CHEN
IPC: H01S5/0232 , H01S5/02253 , H01S5/028 , H01S5/024
CPC classification number: H01S5/0232 , H01S5/02253 , H01S5/0283 , H01S5/02469 , H01S5/183
Abstract: A package structure is provided. The package structure includes a substrate, a frame structure, and a lens portion. The frame structure is disposed on the substrate. A sidewall of the frame structure has multiple lamination traces thereon. The lens portion covers the substrate. The frame structure has a through hole passing through the sidewall, and the through hole includes an edge, and a portion of the lamination traces overlaps the edge of the through hole.
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