-
公开(公告)号:US06428638B2
公开(公告)日:2002-08-06
申请号:US09832448
申请日:2001-04-10
申请人: Lijun Yao , Tadao Ueda
发明人: Lijun Yao , Tadao Ueda
IPC分类号: C22F100
CPC分类号: C22F1/183 , C22F1/04 , C22F1/08 , C23C14/3414
摘要: The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% and a processing rate of at least 100%/second. In particular applications the metallic material comprises one or more of aluminum, copper and titanium.
-
公开(公告)号:US06416595B2
公开(公告)日:2002-07-09
申请号:US09833504
申请日:2001-04-09
申请人: Lijun Yao , Tadao Ueda
发明人: Lijun Yao , Tadao Ueda
IPC分类号: C22C1400
CPC分类号: C22F1/183 , C22F1/04 , C22F1/08 , C23C14/3414
摘要: A titanium material with titanium grains, wherein the average crystal grain size is less than 4 &mgr;m. The material is at least 99.99% (4N purity) titanium. The alloy is especially useful as a sputtering target. The material is produced by processing the material with plastic working of at least 5% at a rate of at least 100%/second.
摘要翻译: 具有钛颗粒的钛材料,其中平均晶粒尺寸小于4μm。 该材料至少为99.99%(4N纯度)钛。 该合金作为溅射靶特别有用。 该材料通过以至少5%的塑性加工方式以至少100%/秒的速率进行加工。
-
公开(公告)号:US06746553B2
公开(公告)日:2004-06-08
申请号:US10165569
申请日:2002-06-07
申请人: Lijun Yao , Tadao Ueda
发明人: Lijun Yao , Tadao Ueda
IPC分类号: C22F100
CPC分类号: C22F1/183 , C22F1/04 , C22F1/08 , C23C14/3414
摘要: The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% and a processing rate of at least 100%/second. In particular applications the metallic material comprises one or more of aluminum, copper and titanium.
摘要翻译: 本发明包括减少材料的晶粒尺寸的方法和形成溅射靶的方法。 本发明包括一种制造溅射靶材料的方法,其中金属材料以至少5%的加工百分比和至少100%/秒的加工率进行塑性加工。 在具体应用中,金属材料包括铝,铜和钛中的一种或多种。
-
公开(公告)号:US06423161B1
公开(公告)日:2002-07-23
申请号:US09627496
申请日:2000-07-28
申请人: Lijun Yao , Tadao Ueda
发明人: Lijun Yao , Tadao Ueda
IPC分类号: C22C2100
CPC分类号: C22F1/183 , C22F1/04 , C22F1/08 , C23C14/3414
摘要: The invention includes a material containing aluminum grains which have an average grain size of less than 20 &mgr;m. The material contains manganese, with a total non-aluminum content of 0.01 to 10.0% by weight. The material is preferably used as a sputtering target. A sputtering target is produced by subjecting the material to plastic working at a processing percentage of at least 5% at a processing rate of at least 100%/second.
摘要翻译: 本发明包括平均粒径小于20μm的含有铝颗粒的材料。 该材料含有锰,总非铝含量为0.01至10.0重量%。 该材料优选用作溅射靶。 通过以至少100%/秒的加工速率使材料以至少5%的加工百分比进行塑性加工来制造溅射靶。
-
-
-