公开(公告)号：US20180130624A1

公开(公告)日：2018-05-10

申请号：US15866804

申请日：2018-01-10

Applicant: Littelfuse, Inc.

Inventor： Wen Yang ,  Hailang Tang ,  Huawei Yin ,  Stephen J. Whitney ,  G. Todd Dietsch

IPC: H01H37/60 ,  H02H9/04

CPC classification number: H01H37/60 ,  H01C7/12 ,  H01H2085/0486 ,  H01H2223/044 ,  H02H9/041

Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals, thereby creating an opening circuit.

公开(公告)号：US10325739B2

公开(公告)日：2019-06-18

申请号：US15866804

申请日：2018-01-10

Applicant: Littelfuse, Inc.

Inventor： Wen Yang ,  Hailang Tang ,  Huawei Yin ,  Stephen J. Whitney ,  G. Todd Dietsch

IPC: H01H37/60 ,  H02H9/04 ,  H01C7/12 ,  H01H85/048

Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals.

公开(公告)号：US20170110279A1

公开(公告)日：2017-04-20

申请号：US15392192

申请日：2016-12-28

Applicant: Littelfuse, Inc.

Inventor： Wen Yang ,  Hailang Tang ,  Hongbing Liu

IPC: H01H85/02 ,  H01C1/14 ,  H01H85/04 ,  H01C7/112 ,  H01C7/12

CPC classification number: H01H37/761 ,  H01C7/10 ,  H01C7/102 ,  H01C7/12 ,  H01C7/126 ,  H01H9/32 ,  H01H61/02 ,  H01H2037/762

Abstract: Exemplary embodiments of the present invention are directed to a circuit protection device, A circuit protection device may comprise a housing defining a cavity and a metal oxide varistor (MOV) disposed within the cavity. The circuit protection device may further comprise a first terminal electrically attached at a first end to the MOV by solder and extending outside of the housing at a second end. An arc shield is disposed within the housing between the first end of the first terminal and at least partially over the solder. The circuit protection device may further comprise a spring configured to bias the arc shield against a micro switch having an indicator portion disposed at least partially outside of the housing. When a voltage surge condition occurs, the MOV changes from a non-conductive state to a conductive state and current flows between the first terminal and a second terminal where the heat generated by the current flowing through the varistor melts the solder and the first end of the first terminal electrically separates from the varistor.

公开(公告)号：US20150228429A1

公开(公告)日：2015-08-13

申请号：US14394143

申请日：2012-10-26

Applicant: LITTELFUSE, INC.

Inventor： Wen Yang ,  Hailang Tang ,  Huawei Yin ,  Stephen J. Whitney ,  G. Todd Dietsch

IPC: H01H37/60 ,  H01C7/12

CPC classification number: H01H37/60 ,  H01C7/12 ,  H01H2085/0486 ,  H01H2223/044 ,  H02H9/041

Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.

Abstract translation: 一种电路保护装置，包括限定室（19）的壳体（15）和设置在室（19）内的金属氧化物变阻器（MOV）堆叠（310）。 第一弹簧（330a）在第一端处通过焊料连接（30）电连接到MOV堆叠（310）的第一输入端子（311a），并在第二端电连接到第一输入线（20a）。 第一弹簧（330a）偏离第一输入端子（311a）。 第二弹簧（330b）通过焊接连接（40）电连接到MOV堆叠（310）的第二输入端子（311b），并在第二端电连接到第二输入线（20b）。 第二导电弹簧（330b）偏离第二输入端子（311b）。 当发生过电压状态时，由MOV堆（310）产生的热会熔化至少一个第一或第二焊料连接（30,40），以使相应的弹簧能够远离相应的MOV堆（310）输入端 （311a，311b），从而形成开路电路。