Solder electroplating bath including brighteners having reduced volatility
    1.
    发明申请
    Solder electroplating bath including brighteners having reduced volatility 有权
    焊接电镀浴,包括挥发性降低的增白剂

    公开(公告)号:US20030159939A1

    公开(公告)日:2003-08-28

    申请号:US10081326

    申请日:2002-02-22

    摘要: In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied by lower molecular weight alcohols. In a preferred embodiment, a diol along with low alcohol is added to a bath comprising sulfonic acid, surfactant, grain refiner and brightening agents comprising an aromatic aldehyde and a carboxylic acid.

    摘要翻译: 根据本发明,具有挥发性增白剂如醛的焊料镀浴的挥发性通过向浴中加入二醇来降低挥发性。 二醇洗澡 二醇有利地为1,3-丙二醇或1,2-丙二醇,并且伴随有较低分子量的醇。 在优选的实施方案中,将二醇与低级醇一起加入到包含磺酸,表面活性剂,晶粒细化剂和包含芳族醛和羧酸的增白剂的浴中。