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51 条记录 (耗时 0.012 秒)

    Tin, lead, and tin-lead alloy plating baths
    1.
    发明授权
    Tin, lead, and tin-lead alloy plating baths 失效
    锡，铅和锡铅合金电镀浴

    公开(公告)号：US4459185A

    公开(公告)日：1984-07-10

    申请号：US532934

    申请日：1983-09-16

    申请人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Masakazu Yoshimoto

    发明人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Masakazu Yoshimoto

    IPC分类号： C25D3/30 ,  C25D3/32 ,  C25D3/34 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60

    CPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60

    摘要： A tin, lead or tin-lead alloy plating bath, which comprises(A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both;(B) at least one of surfactants comprising(a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts,(b) an amphoteric surfactant selected from betaines, or(c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and(C) at least one of levelling agents selected from the group consisting of alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.

    摘要翻译： 锡，铅或锡铅合金电镀浴，其包含（A）含有烷烃磺酸或链烷醇磺酸的主要电镀液，以及二价锡盐或其二价铅盐或两者; （B）至少一种表面活性剂，其包含（a）选自季铵盐，烷基吡啶鎓盐，烷基咪唑啉鎓盐和高级烷基胺盐的阳离子表面活性剂，（b）选自甜菜碱的两性表面活性剂或（ c）选自环氧乙烷和/或环氧丙烷与苯乙烯化酚，高级醇，烷基酚，烷基萘酚，脂肪酸酰胺，脱水山梨糖醇或磷酸酯的缩合产物的非离子表面活性剂; 和（C）选自亚烷基氨基磺酸，羟基喹啉衍生物，苯并三唑衍生物，二烷基亚苯基二胺，苯甲醛衍生物，三嗪衍生物，水杨酸衍生物和腈的至少一种流平剂。

    Bath and method for electrodepositing tin and/or lead
    2.
    发明授权
    Bath and method for electrodepositing tin and/or lead 失效
    用于电沉积锡和/或铅的浴和方法

    公开(公告)号：US3769182A

    公开(公告)日：1973-10-30

    申请号：US3769182D

    申请日：1971-07-06

    申请人： CONVERSION CHEM CORP

    发明人： BECKWITH M ,  HSU G

    IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  C23B5/14 ,  C23B5/16 ,  C23B5/38

    CPC分类号： C25D3/56 ,  C25D3/32 ,  C25D3/36 ,  C25D3/60

    摘要： A plating bath for electrodepositing tin and/or lead contains stannous ion, lead ion, or a mixture thereof, together with a fluoborate, fluosilicate and/or sulfamate electrolyte and a polyoxyalkylated fatty acid alkylolamide surfactant. The bath operates at pH values of less than about 3.0, and very desirable deposits are produced over wide ranges of current densities and under a variety of plating conditions.

    摘要翻译： 用于电沉积锡和/或铅的电镀浴与氟硼酸盐，氟硅酸盐和/或氨基磺酸盐电解质和聚氧化烷基化脂肪酸烷醇酰胺表面活性剂一起含有亚锡离子，铅离子或其混合物。 浴的pH值小于约3.0，并且在宽电流密度范围内和在各种电镀条件下产生非常理想的沉积物。

    Solder electroplating bath including brighteners having reduced volatility
    8.
    发明授权
    Solder electroplating bath including brighteners having reduced volatility 有权
    焊接电镀浴，包括挥发性降低的增白剂

    公开(公告)号：US06730209B2

    公开(公告)日：2004-05-04

    申请号：US10081326

    申请日：2002-02-22

    申请人： Joseph A. Abys ,  Frank Stanley Humiec ,  Kenneth J. Murski ,  Yun Zhang

    发明人： Joseph A. Abys ,  Frank Stanley Humiec ,  Kenneth J. Murski ,  Yun Zhang

    IPC分类号： C25D360

    CPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/60 ,  H05K3/3473

    摘要： In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied by lower molecular weight alcohols. In a preferred embodiment, a diol along with low alcohol is added to a bath comprising sulfonic acid, surfactant, grain refiner and brightening agents comprising an aromatic aldehyde and a carboxylic acid.

    摘要翻译： 根据本发明，具有挥发性增白剂如醛的焊料镀浴的挥发性通过向浴中加入二醇来降低挥发性。 二醇有利地为1,3-丙二醇或1,2-丙二醇，并且伴随有较低分子量的醇。 在优选的实施方案中，将二醇与低级醇一起加入到包含磺酸，表面活性剂，晶粒细化剂和包含芳族醛和羧酸的增白剂的浴中。

    Limiting tin sludge formation in tin or tin/lead electroplating solutions
    10.
    发明授权
    Limiting tin sludge formation in tin or tin/lead electroplating solutions 失效
    限制锡或锡/铅电镀溶液中的锡污泥形成

    公开(公告)号：US5066367A

    公开(公告)日：1991-11-19

    申请号：US585768

    申请日：1990-09-20

    申请人： Fred I. Nobel ,  Barnet D. Ostrow

    发明人： Fred I. Nobel ,  Barnet D. Ostrow

    IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

    CPC分类号： C25D3/36 ,  C25D3/32 ,  C25D3/56 ,  C25D3/60 ,  H05K3/3473

    摘要： Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

    摘要翻译： 用于电镀锡或锡铅合金的浴和方法，其中减少或防止四价锡和氧化锡污泥的形成。 这些浴含有可溶性二价锡化合物，可溶性烷基或烷基磺酸至少一种润湿剂和羟基苯基化合物还原剂。 可以向浴中加入其它化合物以改善其在电镀过程中的性能。