公开(公告)号：US20110013366A1

公开(公告)日：2011-01-20

申请号：US12835961

申请日：2010-07-14

申请人： Luisa COPPOLA ,  Didier Cottet ,  Matteo Fabbri ,  Roland Schmidt

发明人： Luisa COPPOLA ,  Didier Cottet ,  Matteo Fabbri ,  Roland Schmidt

IPC分类号： H05K7/20

CPC分类号： H05K1/0209 ,  H05K2201/066 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10204

摘要： An electronic circuit board includes at least one conductor path and at least one component which is one of an electronic component, electric component and heat emitting component, and which is connected to the conductor path. At least one thermal capacitor is thermally connected to the conductor in vicinity to the at least one component. The at least one thermal capacitor is suitable for transmitting and/or buffering thermal energy of the at least one component.

摘要翻译： 电子电路板包括至少一个导体路径和至少一个作为电子部件，电气部件和发热部件之一的部件，并且连接到导体路径。 至少一个热电容器与至少一个部件附近的导体热连接。 所述至少一个热电容器适用于传输和/或缓冲所述至少一个部件的热能。