公开(公告)号：US20230051475A1

公开(公告)日：2023-02-16

申请号：US17451742

申请日：2021-10-21

Applicant: Lumentum Operations LLC

Inventor： Mikhail DOLGANOV ,  Lijun ZHU ,  Sean BURNS ,  Yuanzhen ZHUANG

IPC: H01S5/042 ,  H01S5/026 ,  H01S5/183

Abstract: A driver circuit may include an optical emitter, a capacitive element, and an inductive element. The driver circuit may include a first switch that, in a closed state, is to cause charging of the inductive element, and when transitioning from the closed state to an open state is to cause discharging of the inductive element to charge the capacitive element. The driver circuit may include a second switch that in a closed state is to cause discharging of the capacitive element to provide an electrical pulse to the optical emitter. The driver circuit may include a signal generator configured to generate a first signal for controlling the open state and the closed state of the first switch, and a pulse shortening element configured to shorten a pulse width of the first signal to generate a second signal for controlling the open state and the closed state of the second switch.

公开(公告)号：US20220299604A1

公开(公告)日：2022-09-22

申请号：US17304074

申请日：2021-06-14

Applicant: Lumentum Operations LLC

Inventor： Mikhail DOLGANOV ,  Lijun ZHU ,  Hao HUANG ,  Sean BURNS

IPC: G01S7/484 ,  G01S17/10 ,  H01S5/042

Abstract: In some implementations, a driver circuit may include a source to provide an electrical input and an array of optical emitters arranged in one or more rows and one or more columns. The array of optical emitters may include an optical emitter associated with a row of the one or more rows and a column of the one or more columns. The driver circuit may include a first switch having an open state and a closed state and a capacitive element connected to the row. The first switch in the closed state may cause charging of the capacitive element. The driver circuit may include a second switch having an open state and a closed state. The second switch in the closed state may select the column, and may cause discharging of the capacitive element through the row and the column to provide an electrical pulse to the optical emitter.

公开(公告)号：US20220229091A1

公开(公告)日：2022-07-21

申请号：US17360260

申请日：2021-06-28

Applicant: Lumentum Operations LLC

Inventor： Sean BURNS ,  Raman SRINIVASAN ,  Lucas MORALES ,  Tian SHI ,  Yuanzhen ZHUANG ,  Cho-Shuen HSIEH ,  Albert HUANG

IPC: G01R1/073 ,  G01R1/067

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

公开(公告)号：US20210325451A1

公开(公告)日：2021-10-21

申请号：US16917124

申请日：2020-06-30

Applicant: Lumentum Operations LLC

Inventor： Yuanzhen ZHUANG ,  Lucas MORALES ,  Raman SRINIVASAN ,  Sean BURNS ,  Siu Kwan CHEUNG ,  Tian SHI ,  Tao LI

IPC: G01R31/28

Abstract: A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.