TRANSMITTING DEVICE PACKAGE STRUCTURE
    2.
    发明申请
    TRANSMITTING DEVICE PACKAGE STRUCTURE 审中-公开
    发送器件封装结构

    公开(公告)号:US20150253520A1

    公开(公告)日:2015-09-10

    申请号:US14304514

    申请日:2014-06-13

    Abstract: A transmitting device package structure comprises a base mounted with a transmitting module, a circuit board, and a cylindrical element. The base comprising a plane part mounted with a transmitting module, and an assembling part disposed on one side of the plane part. The circuit board comprises a board body, an electrical connection side disposed on one end of the board body and connected with the transmitting module, and an electrical connection port disposed an end of the board body opposite to the electrical connection side. The cylindrical element is mounted on the assembling part. The cylindrical element comprises a cylindrical body connected to the external optical fiber, and a coupling lens disposed inside the cylindrical body or one side of the cylindrical body, and the coupling lens couples the optical signal emitted from the transmitting module to the external optical fiber.

    Abstract translation: 发射装置封装结构包括安装有发射模块,电路板和圆柱形元件的基座。 所述基座包括安装有发射模块的平面部分和设置在所述平面部分的一侧上的组装部分。 电路板包括板体,电连接侧,设置在电路板主体的一端并与发射模块连接,电连接端口设置在电路主体的与电连接侧相对的端部。 圆柱形元件安装在组装部件上。 圆柱形元件包括连接到外部光纤的圆柱形主体和设置在圆柱形主体或圆柱体的一侧内部的耦合透镜,耦合透镜将从发送模块发射的光信号耦合到外部光纤。

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