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公开(公告)号：US09854674B1
公开(公告)日：2017-12-26
申请号：US15460683
申请日：2017-03-16
Applicant: LuxNet Corporation
Inventor： Ho-I Chen , Yi-Ching Chiu , Bo-Wei Liu , Hsing-Yen Lin , Hua-Hsin Su
CPC classification number: H05K1/141 , H01R4/02 , H01R4/021 , H01R12/61 , H01R12/62 , H01R12/707 , H05K1/0245 , H05K1/112 , H05K2201/041 , H05K2201/058
Abstract: A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.
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公开(公告)号：US09847307B1
公开(公告)日：2017-12-19
申请号：US15459523
申请日：2017-03-15
Applicant: LuxNet Corporation
Inventor： Ho-I Chen , Po-Chao Huang , Yi-Ching Chiu , Pi-Cheng Law , Hua-Hsin Su
IPC: H01L23/66 , H01L23/498 , H01L23/00 , H01L23/373 , H01P3/08 , H04B10/80
CPC classification number: H01L23/66 , H01L23/3731 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2223/6611 , H01L2223/6616 , H01L2223/6627 , H01L2223/6638 , H01L2224/45014 , H01L2224/45144 , H01L2224/48227 , H01L2924/19107 , H01P3/081 , H04B10/801
Abstract: The present invention relates to a two-end driving, high-frequency sub-substrate structure, comprising a sub-substrate body, wherein: the sub-substrate body has an upper side provided with a first signal pad area and a second signal pad area, the first signal pad area and the second signal pad area are symmetric with respect to each other, each of the first signal pad area and the second signal pad area extends from one of two lateral portions of the sub-substrate body in an extending direction toward a center of the sub-substrate body and terminates in an end, the end of the first signal pad area is adjacent to but spaced from the end of the second signal pad area, the first signal pad area is configured for supporting a semiconductor chip provided thereon, the second signal pad area is provided with a jumper wire connected to an electrode of the semiconductor chip, there are two grounding pad areas provided respectively on two lateral sides of the first signal pad area and the second signal pad area and constituting a portion of a coplanar waveguide, the sub-substrate body has an inner layer or bottom side that is provided with a grounding layer or combined with a grounding layer.
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Patent Agency Ranking
公开(公告)号：US09991674B2
公开(公告)日：2018-06-05
申请号：US15354261
申请日：2016-11-17
Applicant: LuxNet Corporation
Inventor： Pi-Cheng Law , Po-Chao Huang , Hsing-Yen Lin , Chung-Hsin Fu , Hua-Hsin Su
CPC classification number: H01S5/02469 , H01S5/0064 , H01S5/02208 , H01S5/02212 , H01S5/02276 , H01S5/02284 , H01S5/02288 , H01S5/02296 , H01S5/02438 , H01S5/02492
Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.
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公开(公告)号：US20150253520A1
公开(公告)日：2015-09-10
申请号：US14304514
申请日：2014-06-13
Applicant: LuxNet Corporation
Inventor： Yun-Cheng Huang , Chung-Hsin Fu , Hua-Hsin Su , Huang-Shen Lin , Nai-Hsin Chen
IPC: G02B6/42
CPC classification number: G02B6/4206 , G02B6/4215 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4257 , G02B6/428 , G02B6/4292
Abstract: A transmitting device package structure comprises a base mounted with a transmitting module, a circuit board, and a cylindrical element. The base comprising a plane part mounted with a transmitting module, and an assembling part disposed on one side of the plane part. The circuit board comprises a board body, an electrical connection side disposed on one end of the board body and connected with the transmitting module, and an electrical connection port disposed an end of the board body opposite to the electrical connection side. The cylindrical element is mounted on the assembling part. The cylindrical element comprises a cylindrical body connected to the external optical fiber, and a coupling lens disposed inside the cylindrical body or one side of the cylindrical body, and the coupling lens couples the optical signal emitted from the transmitting module to the external optical fiber.
Abstract translation: 发射装置封装结构包括安装有发射模块，电路板和圆柱形元件的基座。 所述基座包括安装有发射模块的平面部分和设置在所述平面部分的一侧上的组装部分。 电路板包括板体，电连接侧，设置在电路板主体的一端并与发射模块连接，电连接端口设置在电路主体的与电连接侧相对的端部。 圆柱形元件安装在组装部件上。 圆柱形元件包括连接到外部光纤的圆柱形主体和设置在圆柱形主体或圆柱体的一侧内部的耦合透镜，耦合透镜将从发送模块发射的光信号耦合到外部光纤。
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公开(公告)号：US10656355B2
公开(公告)日：2020-05-19
申请号：US16413145
申请日：2019-05-15
Applicant: LuxNet Corporation
Inventor： Pi-Cheng Law , Po-Chao Huang , Hsing-Yen Lin , Ya-Hsin Deng , Hua-Hsin Su
Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.
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公开(公告)号：US20180191131A1
公开(公告)日：2018-07-05
申请号：US15670624
申请日：2017-08-07
Applicant: LuxNet Corporation
Inventor： Hsing-Yen Lin , Pi-Cheng Law , Po-Chao Huang , Bo-Wei Liu , Ya-Hsin Deng , Hua-Hsin Su
CPC classification number: H01S5/02469 , H01S5/02236 , H01S5/0224 , H01S5/02272 , H01S5/02476 , H01S5/22 , H01S5/4031
Abstract: The invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer, and an edge emitting laser diode. The heat-dissipating substrate has one side formed with a flat surface for mounting the edge emitting laser diode. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate and/or the metal solder layer have a groove. The ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate and metal solder layer from contacting the ridge of the edge emitting laser diode.
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公开(公告)号：US20180188457A1
公开(公告)日：2018-07-05
申请号：US15822519
申请日：2017-11-27
Applicant: LUXNET CORPORATION
Inventor： Pi-Cheng Law , Po-Chao Huang , Po-Sung Liu , Hsing-Yen Lin , Hua-Hsin Su
CPC classification number: G02B6/4206 , G02B6/02042 , G02B6/14 , G02B6/32 , G02B6/421 , G02B6/4212 , G02B6/4228 , G02B6/423 , G02B6/4237 , G02B6/4243
Abstract: An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.
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