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公开(公告)号:US10128954B2
公开(公告)日:2018-11-13
申请号:US15900357
申请日:2018-02-20
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a light pipe with a sloped reflective surface coupled to the chip, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).
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公开(公告)号:US20190081707A1
公开(公告)日:2019-03-14
申请号:US16189661
申请日:2018-11-13
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver comprising a chip, a semiconductor laser bonded to the chip, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip.
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公开(公告)号:US20160006514A1
公开(公告)日:2016-01-07
申请号:US14854909
申请日:2015-09-15
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronics circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip via a light pipe with a sloped reflective surface, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via the light pipe, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).
Abstract translation: 一种包括芯片,半导体激光器和一个或多个光电检测器的收发器,所述芯片包括光学和光电子器件和电子电路,其中收发器可操作以:通过半导体激光器将光源信号通过芯片通过芯片 具有倾斜反射表面的光管,基于光源信号在芯片中产生第一光信号,经由光管从芯片发送第一光信号,并从光管接收第二光信号并转换第二光信号 通过光电检测器进行电信号。 光信号可以在芯片的顶表面之外传送出去。 一个或多个光电检测器可以集成在芯片中。 光电子器件可以包括集成在芯片中的一个或多个光电检测器。 光管可以是平面光波回路(PLC)。
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公开(公告)号:US09906304B2
公开(公告)日:2018-02-27
申请号:US15651952
申请日:2017-07-17
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip via a light pipe with a sloped reflective surface, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via the light pipe, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).
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公开(公告)号:USRE45390E1
公开(公告)日:2015-02-24
申请号:US13774808
申请日:2013-02-22
Applicant: Luxtera, Inc.
Inventor: Peter De Dobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn, III
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.
Abstract translation: 包括CMOS芯片和耦合到芯片的激光器的收发器可以用于将来自半导体激光器的光源信号传送到CMOS芯片。 光源信号可以用于产生从CMOS芯片发送到耦合到CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由CMOS芯片中的光电检测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面,并且第一光信号可以从CMOS芯片的顶表面传出。 光源信号可以被传送到CMOS芯片,并且可以通过可以包括光栅耦合器的光耦合器从CMOS芯片传送第一光信号。
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公开(公告)号:US20180175940A1
公开(公告)日:2018-06-21
申请号:US15900357
申请日:2018-02-20
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a light pipe with a sloped reflective surface coupled to the chip, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).
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公开(公告)号:USRE45214E1
公开(公告)日:2014-10-28
申请号:US13772155
申请日:2013-02-20
Applicant: Luxtera, Inc.
Inventor: Peter De Dobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn, III
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via a semiconductor laser and one or more photodetectors. The optical and optoelectronic devices may include waveguides, modulators, multiplexers, switches, and couplers. The photodetector may be integrated in the CMOS chip. The photodetector and the semiconductor laser may be mounted on the CMOS chip. The optical signals may be communicated out of and in to a top surface of the CMOS chip. A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry, may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via grating couplers. The optical signals may be communicated out of and in to a top surface of the CMOS chip.
Abstract translation: 包括光学和光电子器件的CMOS芯片上的收发器和电子电路可以用于在CMOS芯片和经由半导体激光器和一个或多个光电探测器耦合到CMOS芯片的光纤之间传送光信号。 光学和光电器件可以包括波导,调制器,多路复用器,开关和耦合器。 光电检测器可以集成在CMOS芯片中。 光检测器和半导体激光器可以安装在CMOS芯片上。 光信号可以在CMOS芯片的顶表面之外传送出去。 包括光学和光电子器件以及电子电路的CMOS芯片上的收发器可以用于在CMOS芯片和经由光栅耦合器耦合到CMOS芯片的光纤之间传送光信号。 光信号可以在CMOS芯片的顶表面之外传送出去。
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公开(公告)号:US10454586B2
公开(公告)日:2019-10-22
申请号:US16189661
申请日:2018-11-13
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
Abstract: A transceiver comprising a chip, a semiconductor laser bonded to the chip, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip.
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公开(公告)号:US20170317758A1
公开(公告)日:2017-11-02
申请号:US15651952
申请日:2017-07-17
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip via a light pipe with a sloped reflective surface, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via the light pipe, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).
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公开(公告)号:US09712243B2
公开(公告)日:2017-07-18
申请号:US14854909
申请日:2015-09-15
Applicant: Luxtera, Inc.
Inventor: Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronics circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip via a light pipe with a sloped reflective surface, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via the light pipe, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).
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