公开(公告)号：US10581526B2

公开(公告)日：2020-03-03

申请号：US16424142

申请日：2019-05-28

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Christopher Bergey ,  Attila Mekis

IPC: H04J14/02 ,  H04B10/25 ,  H04B10/40 ,  G02B6/124 ,  G02B6/12 ,  G02B6/34 ,  G02B6/30 ,  H04B10/50

Abstract: Methods and systems for a bi-directional receiver for standard single-mode fiber based on grating couplers may include, in an integrated circuit, a multi-wavelength grating coupler, and first and second optical sources coupled to the integrated circuit: coupling first and second source optical signals at first and second wavelengths into the photonically-enabled integrated circuit using the first and second optical sources, where the second wavelength is different from the first wavelength, receiving a first optical data signal at the first wavelength from an optical fiber coupled to the multi-wavelength grating coupler, and receiving a second optical data signal at the second wavelength from the optical fiber. Third and fourth optical data signals at the first and second wavelengths may be communicated out of the optoelectronic transceiver via the multi-wavelength grating coupler.

公开(公告)号：US20190238228A1

公开(公告)日：2019-08-01

申请号：US16378119

申请日：2019-04-08

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Peter DeDobbelaere ,  Kosei Yokoyama ,  Sherif Abdalla ,  Steffen Gloeckner ,  John Guckenberger ,  Thierry Pinguet ,  Gianlorenzo Masini ,  Daniel Kucharski

IPC: H04B10/2575 ,  H01L27/12 ,  H04B10/40 ,  H01L21/84

CPC classification number: H04B10/2575 ,  H01L21/84 ,  H01L25/0652 ,  H01L25/167 ,  H01L27/0688 ,  H01L27/1203 ,  H01L2225/06541 ,  H04B10/40

Abstract: Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on two CMOS wafers with different silicon layer thicknesses. The devices may be fabricated on semiconductor-on-insulator (SOI) wafers utilizing a bulk CMOS process and/or on a SOI wafer utilizing a SOI CMOS process. The different thicknesses may be fabricated utilizing a double SOI process and/or a selective area growth process. Cladding layers may be fabricated utilizing one or more oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafer. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. Silicon dioxide or silicon germanium integrated in the CMOS wafer may be utilized as an etch stop layer.

公开(公告)号：US20190123829A1

公开(公告)日：2019-04-25

申请号：US16229694

申请日：2018-12-21

Applicant: Luxtera, Inc.

Inventor： Greg Young ,  Peter DeDobbelaere

IPC: H04B10/40 ,  G02B6/42 ,  H04J14/02 ,  G02B6/12 ,  G02B6/30 ,  H04L29/06 ,  H04J14/04 ,  H04B10/80 ,  H04B10/2581

CPC classification number: H04B10/40 ,  G02B6/12 ,  G02B6/30 ,  G02B6/4204 ,  G02B6/4213 ,  G02B6/4215 ,  G02B6/4246 ,  G02B6/425 ,  H04B10/2581 ,  H04B10/43 ,  H04B10/802 ,  H04J14/02 ,  H04J14/0202 ,  H04J14/04 ,  H04L69/18

Abstract: Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.

公开(公告)号：US10128954B2

公开(公告)日：2018-11-13

申请号：US15900357

申请日：2018-02-20

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Thierry Pinguet ,  Mark Peterson ,  Mark Harrison ,  Alexander G. Dickinson ,  Lawrence C. Gunn

IPC: G02B6/36 ,  H04B10/40 ,  G02B6/42 ,  G02B6/12 ,  G02B6/38

Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a light pipe with a sloped reflective surface coupled to the chip, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).

公开(公告)号：US20190296826A1

公开(公告)日：2019-09-26

申请号：US16424142

申请日：2019-05-28

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Christopher Bergey ,  Attila Mekis

IPC: H04B10/25 ,  H04B10/50 ,  G02B6/30 ,  G02B6/34 ,  H04J14/02 ,  G02B6/124 ,  H04B10/40 ,  G02B6/12

Abstract: Methods and systems for a bi-directional receiver for standard single-mode fiber based on grating couplers may include, in an integrated circuit, a multi-wavelength grating coupler, and first and second optical sources coupled to the integrated circuit: coupling first and second source optical signals at first and second wavelengths into the photonically-enabled integrated circuit using the first and second optical sources, where the second wavelength is different from the first wavelength, receiving a first optical data signal at the first wavelength from an optical fiber coupled to the multi-wavelength grating coupler, and receiving a second optical data signal at the second wavelength from the optical fiber. Third and fourth optical data signals at the first and second wavelengths may be communicated out of the optoelectronic transceiver via the multi-wavelength grating coupler.

公开(公告)号：US10256908B2

公开(公告)日：2019-04-09

申请号：US14729826

申请日：2015-06-03

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Peter DeDobbelaere ,  Kosei Yokoyama ,  Sherif Abdalla ,  Steffen Gloeckner ,  John Guckenberger ,  Thierry Pinguet ,  Gianlorenzo Masini ,  Daniel Kucharski

IPC: H04B10/2575 ,  H04B10/40 ,  H01L21/84 ,  H01L27/12 ,  H01L27/06 ,  H01L25/16 ,  H01L25/065

Abstract: Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include in an optoelectronic transceiver comprising photonic and electronic devices from two complementary metal-oxide semiconductor (CMOS) die with different silicon layer thicknesses for the photonic and electronic devices, the CMOS die bonded together by metal contacts: communicating optical signals and electronic signals to and from said optoelectronic transceiver utilizing a received continuous wave optical signal as a source signal. A first of the CMOS die includes the photonic devices and a second includes the electronic devices. Electrical signals may be communicated between electrical devices to the optical devices utilizing through-silicon vias coupled to the metal contacts. The metal contacts may include back-end metals from a CMOS process. The electronic and photonic devices may be fabricated on SOI wafers, with the SOI wafers being diced to form the CMOS die.

公开(公告)号：US09906304B2

公开(公告)日：2018-02-27

申请号：US15651952

申请日：2017-07-17

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Thierry Pinguet ,  Mark Peterson ,  Mark Harrison ,  Alexander G. Dickinson ,  Lawrence C. Gunn

IPC: G02B6/36 ,  H04B10/40 ,  G02B6/42 ,  G02B6/12 ,  G02B6/38

CPC classification number: H04B10/40 ,  G02B6/12004 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4295 ,  G02B2006/12121

Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip via a light pipe with a sloped reflective surface, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via the light pipe, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).

公开(公告)号：US20190081707A1

公开(公告)日：2019-03-14

申请号：US16189661

申请日：2018-11-13

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Thierry Pinguet ,  Mark Peterson ,  Mark Harrison ,  Alexander G. Dickinson ,  Lawrence C. Gunn

IPC: H04B10/40 ,  G02B6/42 ,  G02B6/12 ,  G02B6/38

CPC classification number: H04B10/40 ,  G02B6/12004 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4295 ,  G02B2006/12121

Abstract: A transceiver comprising a chip, a semiconductor laser bonded to the chip, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip.

公开(公告)号：US10171171B2

公开(公告)日：2019-01-01

申请号：US15642763

申请日：2017-07-06

Applicant: Luxtera, Inc.

Inventor： Greg Young ,  Peter DeDobbelaere

IPC: H04J14/04 ,  H04J14/02 ,  H04B10/00 ,  H04B10/40 ,  G02B6/30 ,  H04B10/2581 ,  H04B10/80 ,  H04L29/06 ,  G02B6/42 ,  G02B6/12 ,  H04B10/43

Abstract: Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.

公开(公告)号：US20170026123A1

公开(公告)日：2017-01-26

申请号：US14612496

申请日：2015-02-03

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Christopher Bergey ,  Attila Mekis

IPC: H04B10/25 ,  G02B6/34 ,  G02B6/124 ,  G02B6/12 ,  H04J14/02 ,  H04B10/40

CPC classification number: H04B10/2503 ,  G02B6/12007 ,  G02B6/124 ,  G02B6/305 ,  G02B6/34 ,  H04B10/40 ,  H04B10/506 ,  H04J14/0202

Abstract: Methods and systems for a bi-directional receiver for standard single-mode fiber based on grating couplers may include, in a photonically-enabled integrated circuit comprising an optoelectronic transceiver, a multi-wavelength grating coupler, and first and second optical source assemblies coupled to the photonically-enabled integrated circuit: coupling first and second source optical signals at first and second wavelengths into the photonically-enabled integrated circuit using the first and second optical source assemblies, where the second wavelength is different from the first wavelength, receiving a first optical data signal at the first wavelength from an optical fiber coupled to the multi-wavelength grating coupler, and receiving a second optical data signal at the second wavelength from the optical fiber. Third and fourth optical data signals at the first and second wavelengths may be communicated out of the optoelectronic transceiver via the multi-wavelength grating coupler.

Abstract translation: 用于基于光栅耦合器的标准单模光纤的双向接收器的方法和系统可以包括在包括光电收发器的光子学启用的集成电路中，多波长光栅耦合器以及耦合到 所述光子学使能集成电路：使用所述第一和第二光源组件将第一和第二波长的第一和第二源光信号耦合到所述光子启用集成电路中，其中所述第二波长不同于所述第一波长，接收第一光学 从耦合到多波长光栅耦合器的光纤获得第一波长的数据信号，以及从光纤接收第二波长的第二光数据信号。 可以经由多波长光栅耦合器将第一和第二波长的第三和第四光学数据信号传送出光电收发器。