公开(公告)号：US10234642B2

公开(公告)日：2019-03-19

申请号：US16004817

申请日：2018-06-11

Applicant: Luxtera, Inc.

Inventor： Mark Peterson

IPC: G02B6/38 ,  G02B6/42

Abstract: Methods and systems for a multi-fiber push-on/pull-off connector locking clip are disclosed and may include operatively coupling a multi-fiber push-on/push-off (MPO) connector to an MPO adaptor by inserting the MPO connector into the MPO adaptor, where the MPO connector comprises an MPO connector pull-to-release housing. The MPO connector may be secured to the MPO adaptor by placing an MPO locking clip adjacent to the MPO connector pull-to-release housing, thereby preventing the MPO connector pull-to-release housing from being actuated. An optical cable may be coupled to the MPO connector. The adaptor may be coupled to an optical device, which may include an optical transceiver. The MPO locking clip may be plastic or metal. The MPO connector and the MPO connector pull-to-release housing may be plastic.

公开(公告)号：US09906304B2

公开(公告)日：2018-02-27

申请号：US15651952

申请日：2017-07-17

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Thierry Pinguet ,  Mark Peterson ,  Mark Harrison ,  Alexander G. Dickinson ,  Lawrence C. Gunn

IPC: G02B6/36 ,  H04B10/40 ,  G02B6/42 ,  G02B6/12 ,  G02B6/38

CPC classification number: H04B10/40 ,  G02B6/12004 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4295 ,  G02B2006/12121

Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip via a light pipe with a sloped reflective surface, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via the light pipe, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).

公开(公告)号：US09356701B2

公开(公告)日：2016-05-31

申请号：US14475484

申请日：2014-09-02

Applicant: Luxtera, Inc.

Inventor： Mark Peterson ,  Greg Young ,  Peter De Dobbelaere

IPC: H04B10/40 ,  H04B10/70 ,  H04B10/80 ,  H01L21/84 ,  H01L27/12 ,  H04B10/43

CPC classification number: H04B10/43 ,  G02B6/1225 ,  G02B2006/12061 ,  G02B2006/12142 ,  H01L21/84 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L25/167 ,  H01L27/1203 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04B10/70 ,  H04B10/801 ,  H01L2924/00014

Abstract: Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an optical source external to the silicon photonic interposer. The received CW optical signals may be processed based on electrical signals received from a CMOS electronics die bonded to the interposer, and modulated optical signals may be received in the interposer via optical couplers on the interposer. Electrical signals may be generated in the interposer based on the received modulated optical signals, and may be communicated to the CMOS electronics die. The generated electrical signals to may be communicated to the CMOS electronics die via copper pillars. The CW optical signals may be received in the interposer from an optical source assembly coupled to the interposer. The CW optical signals may be received from optical fibers coupled to the interposer.

Abstract translation: 公开了用于光插入器的方法和系统，并且可以包括从硅光子插入器外部的光源接收硅光插入器中的一个或多个连续波（CW）光信号。 接收的CW光信号可以基于从连接到插入器的CMOS电子器件管芯接收的电信号来处理，并且经调制的光信号可以经由插入器上的光耦合器被接收在插入器中。 可以基于接收到的调制光信号在插入器中产生电信号，并且可以将信号传送到CMOS电子管芯。 产生的电信号可以经由铜支柱传送到CMOS电子管芯。 CW光信号可以从耦合到插入器的光源组件接收在插入器中。 CW光信号可以从耦合到插入器的光纤接收。

公开(公告)号：USRE45390E1

公开(公告)日：2015-02-24

申请号：US13774808

申请日：2013-02-22

Applicant: Luxtera, Inc.

Inventor： Peter De Dobbelaere ,  Thierry Pinguet ,  Mark Peterson ,  Mark Harrison ,  Alexander G. Dickinson ,  Lawrence C. Gunn, III

IPC: G02B6/12 ,  G02B6/26 ,  H05K1/18

CPC classification number: H04B10/40 ,  G02B6/12004 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4295 ,  G02B2006/12121

Abstract: A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.

Abstract translation: 包括CMOS芯片和耦合到芯片的激光器的收发器可以用于将来自半导体激光器的光源信号传送到CMOS芯片。 光源信号可以用于产生从CMOS芯片发送到耦合到CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由CMOS芯片中的光电检测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面，并且第一光信号可以从CMOS芯片的顶表面传出。 光源信号可以被传送到CMOS芯片，并且可以通过可以包括光栅耦合器的光耦合器从CMOS芯片传送第一光信号。

公开(公告)号：US08772704B2

公开(公告)日：2014-07-08

申请号：US13894052

申请日：2013-05-14

Applicant: Luxtera, Inc.

Inventor： Michael Mack ,  Mark Peterson ,  Steffen Gloeckner ,  Adithyaram Narasimha ,  Roger Koumans ,  Peter De Dobbelaere

IPC: G02F1/01 ,  G01N21/86 ,  G02B5/30 ,  G01J3/447

CPC classification number: G02B6/43 ,  G02B6/305 ,  G02B6/32 ,  G02B6/34 ,  G02B6/4208 ,  G02B6/4214 ,  G02B26/105 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/187 ,  H04B10/503

Abstract: Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The CMOS chip may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted into the photonically enabled CMOS chip, which may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The CMOS chip may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench.

Abstract translation: 公开了一种用于光子学互补金属氧化物半导体（CMOS）芯片的方法和系统。 CMOS芯片可以包括激光器，微透镜，转向镜和光学台，并且可以使用激光产生光信号，利用微透镜聚焦光信号，并以由转动限定的角度反射光信号 镜子。 反射的光信号可以被传输到光子启用的CMOS芯片，其可以包括非互易偏振旋转器，其包括闭锁法拉第旋转器。 CMOS芯片可以包括互逆偏振旋转器，其可以包括半波片，其包括可操作地耦合到光学平台的双折射材料。 转向镜可以集成在光学台中并且可以反射光学信号以透过可操作地耦合到光学台的盖。

公开(公告)号：US10374719B2

公开(公告)日：2019-08-06

申请号：US16180715

申请日：2018-11-05

Applicant: Luxtera, Inc.

Inventor： Mark Peterson ,  Greg Young ,  Peter De Dobbelaere

IPC: H04B10/43 ,  G02B6/122 ,  H01L21/84 ,  H01L23/498 ,  H01L25/16 ,  H01L27/12 ,  H04B10/80 ,  H04B10/70 ,  G02B6/12

Abstract: Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.

公开(公告)号：US10128954B2

公开(公告)日：2018-11-13

申请号：US15900357

申请日：2018-02-20

Applicant: Luxtera, Inc.

Inventor： Peter DeDobbelaere ,  Thierry Pinguet ,  Mark Peterson ,  Mark Harrison ,  Alexander G. Dickinson ,  Lawrence C. Gunn

IPC: G02B6/36 ,  H04B10/40 ,  G02B6/42 ,  G02B6/12 ,  G02B6/38

Abstract: A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a light pipe with a sloped reflective surface coupled to the chip, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).

公开(公告)号：US20180069634A1

公开(公告)日：2018-03-08

申请号：US15796063

申请日：2017-10-27

Applicant: Luxtera, Inc.

Inventor： Mark Peterson ,  Greg Young ,  Peter De Dobbelaere

IPC: H04B10/43 ,  H04B10/80 ,  H04B10/70 ,  H01L23/498 ,  H01L21/84 ,  H01L27/12 ,  H01L25/16 ,  G02B6/122 ,  G02B6/12

CPC classification number: H04B10/43 ,  G02B6/1225 ,  G02B2006/12061 ,  G02B2006/12142 ,  H01L21/84 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L25/167 ,  H01L27/1203 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04B10/70 ,  H04B10/801 ,  H01L2924/00014

Abstract: Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.

公开(公告)号：US20200162185A1

公开(公告)日：2020-05-21

申请号：US16512983

申请日：2019-07-16

Applicant: Luxtera, Inc.

Inventor： Mark Peterson ,  Subal Sahni ,  Peter De Dobbelaere

IPC: H04J14/02 ,  H04B10/40 ,  G02B6/42 ,  G02B6/293

Abstract: Methods and systems for a free space CWDM MUX/DEMUX for integration with a grating coupler based silicon platform may include an optical assembly coupled to a photonic chip. The optical assembly includes a lens array on the top surface of the chip, an angled mirror, a transparent spacer, and a plurality of thin film filters. The optical assembly may receive an input optical signal comprising a plurality of optical signals at different wavelengths via an optical fiber coupled to the optical assembly, communicate the plurality of optical signals through the transparent spacer, pass a first of the plurality of optical signals through a corresponding one of the plurality of thin film filters while reflecting others of the plurality of optical signals back into the transparent spacer, and reflect the others of the plurality of signals towards a second of the plurality of thin film filters.

公开(公告)号：US10355805B2

公开(公告)日：2019-07-16

申请号：US16059797

申请日：2018-08-09

Applicant: Luxtera, Inc.

Inventor： Mark Peterson ,  Subal Sahni ,  Peter De Dobbelaere

IPC: H04B10/00 ,  H04J14/02 ,  G02B6/293 ,  H04J14/00

Abstract: Methods and systems for a free space CWDM MUX/DEMUX for integration with a grating coupler based silicon platform may include an optical assembly coupled to a photonic chip. The optical assembly includes a lens array on the top surface of the chip, an angled mirror, a plurality of transparent spacers, and a plurality of thin film filters. The optical assembly may receive an input optical signal comprising a plurality of optical signals at different wavelengths via an optical fiber coupled to the optical assembly, communicate the plurality of optical signals through a first of the plurality of transparent spacers, pass a first of the plurality of optical signals through a corresponding one of the plurality of thin film filters while reflecting others of the plurality of optical signals back into the first of the plurality of transparent spacers, and reflect the others of the plurality of signals towards a second of the plurality of thin film filters.