摘要:
A superconducting joint and a cooling surface are provided as a combination. The superconducting joint joins superconducting wires each comprising superconducting filaments electrically joined together. The cooling surface comprises a thermally and electrically conductive material. An electrically isolating surface coating is provided on the cooling surface. The superconducting joint, the surface coating and the cooling surface are in thermal contact. The superconducting joint is electrically isolated from the cooling surface by the surface coating. The tails of the superconducting wires are wrapped around the electrically isolating surface coating.
摘要:
A superconducting joint and a cooling surface are provided as a combination. The superconducting joint joins superconducting wires each comprising superconducting filaments electrically joined together. The cooling surface comprises a thermally and electrically conductive material. An electrically isolating surface coating is provided on the cooling surface. The superconducting joint, the surface coating and the cooling surface are in thermal contact. The superconducting joint is electrically isolated from the cooling surface by the surface coating. The tails of the superconducting wires are wrapped around the electrically isolating surface coating.
摘要:
A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.
摘要:
A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process.
摘要:
A superconducting magnet assembly comprising a superconducting magnet (1) which, under working conditions, generates a magnetic field in a working volume, the superconducting magnet being connected in parallel with a series combination of a superconducting fault current limiter (7) and a resistor (5). The magnet is further connected in parallel to a DC power source (4) whereby under working conditions, the magnet can be energised by the power source to generate a desired magnetic field in the working volume.
摘要:
A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.
摘要:
A superconducting magnet assembly comprises a superconducting magnet which, under working conditions, generates a magnetic field in a working volume. The superconducting magnet is connected in parallel with a series combination of a superconducting fault current limiter and a resistor, and with a DC power source. Under working conditions, the magnet can be energized by the power source to generate a desired magnetic field in the working volume.
摘要:
There is provided a method of forming an encapsulated coupled coil arrangement. The method comprises: coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process.
摘要:
In a method for forming joints between MgB2 filaments of superconducting wires, the MgB2 filaments from the wires to be joined are exposed, and the exposed filaments are then exposed to a mixture of magnesium powder and boron powder in a furnace, and the MgB2 filaments and the magnesium and boron powders are pressed together in the furnace. The MgB2 filaments and the magnesium and the boron powders in the furnace are heated, and oxygen that is present within the furnace is preferentially trapped, and thus removed from the joint, by providing titanium within the furnace.