Superconducting joints
    1.
    发明授权
    Superconducting joints 有权
    超导接头

    公开(公告)号:US09251933B2

    公开(公告)日:2016-02-02

    申请号:US13945141

    申请日:2013-07-18

    摘要: A superconducting joint and a cooling surface are provided as a combination. The superconducting joint joins superconducting wires each comprising superconducting filaments electrically joined together. The cooling surface comprises a thermally and electrically conductive material. An electrically isolating surface coating is provided on the cooling surface. The superconducting joint, the surface coating and the cooling surface are in thermal contact. The superconducting joint is electrically isolated from the cooling surface by the surface coating. The tails of the superconducting wires are wrapped around the electrically isolating surface coating.

    摘要翻译: 提供超导接头和冷却表面作为组合。 超导接头连接超导线,每个超导线包括电连接在一起的超导细丝。 冷却表面包括导热材料。 在冷却表面上设置电绝缘表面涂层。 超导接头,表面涂层和冷却表面是热接触的。 超导接头通过表面涂层与冷却表面电隔离。 超导线的尾部缠绕在电绝缘表面涂层上。

    SUPERCONDUCTING JOINTS
    2.
    发明申请
    SUPERCONDUCTING JOINTS 有权
    超级联接

    公开(公告)号:US20140024534A1

    公开(公告)日:2014-01-23

    申请号:US13945141

    申请日:2013-07-18

    IPC分类号: H01B12/16

    摘要: A superconducting joint and a cooling surface are provided as a combination. The superconducting joint joins superconducting wires each comprising superconducting filaments electrically joined together. The cooling surface comprises a thermally and electrically conductive material. An electrically isolating surface coating is provided on the cooling surface. The superconducting joint, the surface coating and the cooling surface are in thermal contact. The superconducting joint is electrically isolated from the cooling surface by the surface coating. The tails of the superconducting wires are wrapped around the electrically isolating surface coating.

    摘要翻译: 提供超导接头和冷却表面作为组合。 超导接头连接超导线,每个超导线包括电连接在一起的超导细丝。 冷却表面包括导热材料。 在冷却表面上设置电绝缘表面涂层。 超导接头,表面涂层和冷却表面是热接触的。 超导接头通过表面涂层与冷却表面电隔离。 超导线的尾部缠绕在电绝缘表面涂层上。

    Method of forming a coupled coil arrangement
    3.
    发明授权
    Method of forming a coupled coil arrangement 有权
    形成耦合线圈装置的方法

    公开(公告)号:US08307534B2

    公开(公告)日:2012-11-13

    申请号:US13360872

    申请日:2012-01-30

    IPC分类号: H01L39/24

    摘要: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.

    摘要翻译: 一种形成封装的耦合线圈装置的方法。 该方法包括使用超导接合合金将第一线圈的第一引线通过焊接或输注耦合到电路装置的第二引线; 并将第一线圈和电路装置的第一线圈,电路装置和接合引线封装在封装材料中。 接合合金的熔点高于具有封装工艺的封装材料经历的最高温度。

    Method of forming a coupled coil arrangement
    4.
    发明授权
    Method of forming a coupled coil arrangement 有权
    形成耦合线圈装置的方法

    公开(公告)号:US08136222B2

    公开(公告)日:2012-03-20

    申请号:US12388154

    申请日:2009-02-18

    IPC分类号: H01L39/24

    摘要: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process.

    摘要翻译: 一种形成封装的耦合线圈装置的方法。 该方法包括使用超导接合合金将第一线圈的第一引线通过焊接或输注耦合到电路装置的第二引线; 并将第一线圈和电路装置的第一线圈,电路装置和接合引线封装在封装材料中。 接合合金的熔点高于包封材料在封装过程中经历的最高温度。

    Apparatus for Quench Protection and Stabilizing Decay in a Quasi-persistent Superconducting Magnet
    5.
    发明申请
    Apparatus for Quench Protection and Stabilizing Decay in a Quasi-persistent Superconducting Magnet 有权
    准持久性超导磁体淬火保护和稳定腐蚀的装置

    公开(公告)号:US20100073115A1

    公开(公告)日:2010-03-25

    申请号:US12525025

    申请日:2008-02-29

    IPC分类号: H01F6/00

    摘要: A superconducting magnet assembly comprising a superconducting magnet (1) which, under working conditions, generates a magnetic field in a working volume, the superconducting magnet being connected in parallel with a series combination of a superconducting fault current limiter (7) and a resistor (5). The magnet is further connected in parallel to a DC power source (4) whereby under working conditions, the magnet can be energised by the power source to generate a desired magnetic field in the working volume.

    摘要翻译: 一种超导磁体组件,包括超导磁体(1),其在工作条件下产生工作体积中的磁场,所述超导磁体与超导故障限流器(7)和电阻器(7)的串联组合并联连接, 5)。 磁体进一步与直流电源(4)并联连接,由此在工作条件下,磁体可由电源激励,以在工作容积中产生所需的磁场。

    Method of Forming a Coupled Coil Arrangement
    6.
    发明申请
    Method of Forming a Coupled Coil Arrangement 有权
    形成耦合线圈布置的方法

    公开(公告)号:US20120124823A1

    公开(公告)日:2012-05-24

    申请号:US13360872

    申请日:2012-01-30

    IPC分类号: H01L39/24 H01F7/06

    摘要: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.

    摘要翻译: 一种形成封装的耦合线圈装置的方法。 该方法包括使用超导接合合金将第一线圈的第一引线通过焊接或输注耦合到电路装置的第二引线; 并将第一线圈和电路装置的第一线圈,电路装置和接合引线封装在封装材料中。 接合合金的熔点高于具有封装工艺的封装材料经历的最高温度。

    METHOD OF FORMING A COUPLED COIL ARRANGEMENT
    8.
    发明申请
    METHOD OF FORMING A COUPLED COIL ARRANGEMENT 有权
    形成耦合线圈布置的方法

    公开(公告)号:US20100064506A1

    公开(公告)日:2010-03-18

    申请号:US12388154

    申请日:2009-02-18

    IPC分类号: H01F41/00 H01F5/04

    摘要: There is provided a method of forming an encapsulated coupled coil arrangement. The method comprises: coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process.

    摘要翻译: 提供一种形成封装的耦合线圈装置的方法。 该方法包括:使用超导接合合金通过焊接或浸渍将第一线圈的第一引线耦合到电路装置的第二引线; 并将第一线圈和电路装置的第一线圈,电路装置和接合引线封装在封装材料中。 接合合金的熔点高于包封材料在封装过程中经历的最高温度。