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公开(公告)号：US11630002B2
公开(公告)日：2023-04-18
申请号：US17169939
申请日：2021-02-08
Applicant: MACRONIX International Co., Ltd.
Inventor： Yuchih Yeh , Jianshing Liu , Chin Chu Chung , Nai-Ping Kuo , Shihchou Juan
Abstract: A method for sensing temperature in memory die, memory die and memory with temperature sensing function are provides. The memory die includes at least one temperature monitoring for outputting a temperature status in the memory die; a temperature sensor, arranged in the memory die for sensing an operation temperature in the memory die; and a control logic unit, coupled to the temperature sensor for receiving the operation temperature and coupled to the temperature monitoring pin. The control logic unit compares the operation temperature and a threshold value received from outside of the memory die to generate a comparison result, and outputs the temperature status through the temperature monitoring according to the comparison result.
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公开(公告)号：US20220252460A1
公开(公告)日：2022-08-11
申请号：US17169939
申请日：2021-02-08
Applicant: MACRONIX International Co., Ltd.
Inventor： Yuchih Yeh , Jianshing Liu , Chin Chu Chung , Nai-Ping Kuo , Shihchou Juan
Abstract: A method for sensing temperature in memory die, memory die and memory with temperature sensing function are provides. The memory die includes at least one temperature monitoring for outputting a temperature status in the memory die; a temperature sensor, arranged in the memory die for sensing an operation temperature in the memory die; and a control logic unit, coupled to the temperature sensor for receiving the operation temperature and coupled to the temperature monitoring pin. The control logic unit compares the operation temperature and a threshold value received from outside of the memory die to generate a comparison result, and outputs the temperature status through the temperature monitoring according to the comparison result.
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