公开(公告)号：US20190200488A1

公开(公告)日：2019-06-27

申请号：US16229219

申请日：2018-12-21

Applicant: MCMASTER UNIVERSITY

Inventor： Souvik Pal ,  Hosein Moazami-goodarzi ,  Suvojit Ghosh ,  Kathryn Thorn ,  Ishwar K. Puri

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  H05K7/20781 ,  H05K7/20836

Abstract: A plate-fin heat exchanger has a gas coolant flow path whose length is at least twice its thickness, with thickness measured substantially transverse to the gas coolant flow path and substantially transverse to the liquid coolant flow path. The heat exchanger is well suited (although not limited) to use in cooling units for information technology equipment, and can provide substantial cooling while fitting within an enclosure having the same external form factors as standardized rack-mountable ITE configured to fit into standard IT racks. Thus, a cooling unit incorporating the heat exchanger can be installed just as a rack-mountable server is installed. The heat exchanger can fit within an enclosure whose height, measured substantially parallel to the thickness of the heat exchanger and hence substantially transverse to the gas coolant flow path and substantially transverse to the liquid coolant flow path, is a positive integral multiple of RU (1.75 inches).