公开(公告)号：US20220357211A1

公开(公告)日：2022-11-10

申请号：US17719387

申请日：2022-04-13

Applicant: MEDIATEK INC.

Inventor： Min-Hang Hsieh ,  Jyun-Jia Huang ,  Chien-Sheng Chao ,  Ghien-An Shih ,  Ching-Chung Ko ,  Yu-Cheng Su ,  Lin-Chien Chen ,  Ai-Yun Liu ,  Chia-Hsin Hu

IPC: G01K7/01

Abstract: The present invention provides a processing circuit including logic cells and a thermal sensor. The thermal sensor is positioned within the logic cells and surrounded by the logic cells, and the logic cells and the thermal sensor are all implemented by core devices.