公开(公告)号：US11467041B2

公开(公告)日：2022-10-11

申请号：US16149151

申请日：2018-10-02

Applicant: MEDIATEK INC.

Inventor： Ta-Hsin Lin ,  Jyun-Jia Huang

IPC: G01K7/24 ,  H01L23/522 ,  H01L23/532 ,  G01K7/34 ,  H01L49/02 ,  H01L23/528 ,  G01K7/20 ,  G01K7/18 ,  H01L23/34

Abstract: The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.

公开(公告)号：US20190204163A1

公开(公告)日：2019-07-04

申请号：US16149151

申请日：2018-10-02

Applicant: MEDIATEK INC.

Inventor： Ta-Hsin Lin ,  Jyun-Jia Huang

IPC: G01K7/24 ,  H01L23/522 ,  H01L23/532 ,  H01L23/528 ,  H01L49/02 ,  H01L23/34 ,  G01K7/34

CPC classification number: G01K7/24 ,  G01K7/183 ,  G01K7/186 ,  G01K7/206 ,  G01K7/34 ,  H01L23/34 ,  H01L23/5228 ,  H01L23/528 ,  H01L23/53228 ,  H01L28/20

Abstract: The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.

公开(公告)号：US20230228629A1

公开(公告)日：2023-07-20

申请号：US17990730

申请日：2022-11-20

Applicant: MEDIATEK INC.

Inventor： Min-Hang Hsieh ,  Jyun-Jia Huang ,  Chien-Sheng Chao

IPC: G01K15/00 ,  G01K7/01

CPC classification number: G01K15/005 ,  G01K7/01

Abstract: The present invention provides an adaptive temperature slope calibration method of a thermal sensor, wherein the method includes the steps of: obtaining a parameter of the thermal sensor under a temperature environment; calibrating a temperature slope of the thermal sensor by using the parameter of the thermal sensor obtained under the temperature environment without using parameter(s) of the thermal sensor under other temperature environment(s); and storing the temperature slope of the thermal sensor for subsequent use of detecting temperature.

公开(公告)号：US11513012B2

公开(公告)日：2022-11-29

申请号：US16867897

申请日：2020-05-06

Applicant: MEDIATEK INC.

Inventor： Ta-Hsin Lin ,  Jyun-Jia Huang

IPC: G01K15/00 ,  G01K7/00

Abstract: A thermal sensor with non-ideal coefficient elimination is shown. The thermal sensor has a bandgap circuit, a dual-phase voltage-to-frequency converter, and a frequency meter. The bandgap circuit outputs a temperature-dependent voltage. The dual-phase voltage-to-frequency converter is coupled to the bandgap circuit in the normal phase to perform a voltage-to-frequency conversion based on the temperature-dependent voltage, and is disconnected from the bandgap circuit in the coefficient capturing phase to perform the voltage-to-frequency conversion based on the supply voltage. The frequency meter is coupled to the dual-phase voltage-to-frequency converter to calculate the temperature-dependent frequency corresponding to the normal phase of the dual-phase voltage-to-frequency converter. The frequency meter also calculates the temperature-independent frequency corresponding to the coefficient capturing phase of the dual-phase voltage-to-frequency converter. The temperature-dependent frequency and the temperature-independent frequency are provided for temperature evaluation with non-ideal coefficient elimination.

公开(公告)号：US20220357211A1

公开(公告)日：2022-11-10

申请号：US17719387

申请日：2022-04-13

Applicant: MEDIATEK INC.

Inventor： Min-Hang Hsieh ,  Jyun-Jia Huang ,  Chien-Sheng Chao ,  Ghien-An Shih ,  Ching-Chung Ko ,  Yu-Cheng Su ,  Lin-Chien Chen ,  Ai-Yun Liu ,  Chia-Hsin Hu

IPC: G01K7/01

Abstract: The present invention provides a processing circuit including logic cells and a thermal sensor. The thermal sensor is positioned within the logic cells and surrounded by the logic cells, and the logic cells and the thermal sensor are all implemented by core devices.