公开(公告)号：US20240347479A1

公开(公告)日：2024-10-17

申请号：US18611681

申请日：2024-03-20

Applicant: MEDIATEK INC.

Inventor： Chu-Chia Chang ,  Pei-Haw Tsao ,  Peng-Yu Huang ,  Yu-Liang Hsiao ,  Wei-Fan Chen

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/564 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package includes a package substrate having a top surface and an opposing bottom surface. The package substrate includes a top build-up wiring layer and an upper dielectric layer covering the top build-up wiring layer. A semiconductor device and a passive component are mounted on the top surface of the package substrate in a side-by-side manner. A molding compound encapsulates the semiconductor device and the passive component on the top surface of the package substrate. A cavity is disposed between the passive component and the top surface of the package substrate. A moisture passing gap is disposed in the top build-up wiring layer of the package substrate