公开(公告)号：US20240096860A1

公开(公告)日：2024-03-21

申请号：US18233863

申请日：2023-08-14

Applicant: MEDIATEK INC.

Inventor： Tai-Hao Peng ,  Yao-Tsung Huang

IPC: H01L25/10 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L25/165 ,  H01L24/48 ,  H01L2225/1017 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1205 ,  H01L2924/1436

Abstract: A multi-die package on package includes a bottom package having a first device die and a second device die. A top package including a memory die is stacked on the bottom package.