专利检索 ap:("MEDIATEK INC.") AND inv:"Tai-Hao Peng" 第 1 页

1.

发明公开
MULTI-DIE PACKAGE ON PACKAGE 审中-公开

公开(公告)号：US20240096860A1

公开(公告)日：2024-03-21

申请号：US18233863

申请日：2023-08-14

申请人： MEDIATEK INC.

发明人： Tai-Hao Peng , Yao-Tsung Huang

IPC分类号： H01L25/10 , H01L23/498 , H01L25/16

CPC分类号： H01L25/105 , H01L23/49816 , H01L25/165 , H01L24/48 , H01L2225/1017 , H01L2225/1041 , H01L2225/1058 , H01L2924/1205 , H01L2924/1436

摘要： A multi-die package on package includes a bottom package having a first device die and a second device die. A top package including a memory die is stacked on the bottom package.