公开(公告)号：US20240314920A1

公开(公告)日：2024-09-19

申请号：US18595907

申请日：2024-03-05

Applicant: MEDIATEK INC.

Inventor： Tso-Ju YI ,  Chung-Fa LEE

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/0222 ,  H05K1/114 ,  H05K2201/0939 ,  H05K2201/09509 ,  H05K2201/10734

Abstract: An electronic system is provided. The electronic system includes a base and a semiconductor device. The base having a device-attach region includes a build-up layer structure, a vertical interconnect structure and a first through via. The vertical interconnect structure and the first through via are formed passing through the build-up layer structure and located in the device-attach region. The vertical interconnect structure includes a buried via and a blind via electrically coupled to the buried via. The first through via is a straight through via. The semiconductor device is mounted on the device-attach region of the base.