公开(公告)号：US20200381365A1

公开(公告)日：2020-12-03

申请号：US16994764

申请日：2020-08-17

Applicant: MEDIATEK Inc.

Inventor： Wen-Sung HSU ,  Tao CHENG ,  Nan-Cheng CHEN ,  Che-Ya CHOU ,  Wen-Chou WU ,  Yen-Ju LU ,  Chih-Ming HUNG ,  Wei-Hsiu HSU

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L23/31 ,  H01L25/065 ,  H01L25/16 ,  H01L23/50 ,  H01L23/498 ,  H01L21/683 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/22

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US20230334838A1

公开(公告)日：2023-10-19

申请号：US17724008

申请日：2022-04-19

Applicant: MEDIATEK INC.

Inventor： Chih-Ming HUNG ,  Chung-Hung TSAI ,  Shao-Hsiang CHANG ,  Shih-Jung CHUANG ,  Chun-Nan LI

IPC: G06V10/80 ,  H04N5/232 ,  G01S13/86 ,  G01S13/72 ,  G01S13/58

CPC classification number: G06V10/803 ,  H04N5/23212 ,  H04N5/23267 ,  G01S13/867 ,  G01S13/72 ,  G01S13/58

Abstract: A method for motion prediction includes receiving spatial information output by a radio-wave sensor, wherein the spatial information includes position and velocity of at least one point; receiving an image captured by a camera; tracking at least one object based on the spatial information and the image to obtain a consolidated tracking result; predicting a motion trajectory of the at least one object based on the consolidated tracking result to obtain a prediction result; and controlling the camera according to the prediction result.

公开(公告)号：US20190051609A1

公开(公告)日：2019-02-14

申请号：US16163614

申请日：2018-10-18

Applicant: MEDIATEK Inc.

Inventor： Wen-Sung HSU ,  Tao CHENG ,  Nan-Cheng CHEN ,  Che-Ya CHOU ,  Wen-Chou WU ,  Yen-Ju LU ,  Chih-Ming HUNG ,  Wei-Hsiu HSU

IPC: H01L23/538 ,  H01L25/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.