公开(公告)号：US20230063689A1

公开(公告)日：2023-03-02

申请号：US18047861

申请日：2022-10-19

Applicant: Medtronic MiniMed, Inc.

Inventor： Daniel Hahn ,  David L. Probst ,  Randal C. Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  A61B5/145 ,  A61B5/1468

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

公开(公告)号：US20210106226A1

公开(公告)日：2021-04-15

申请号：US17112394

申请日：2020-12-04

Applicant: Medtronic MiniMed, Inc.

Inventor： Daniel Hahn ,  David L. Probst ,  Randal C. Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  A61B5/145 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  A61B5/1468

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

公开(公告)号：US20190090743A1

公开(公告)日：2019-03-28

申请号：US15716426

申请日：2017-09-26

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Daniel Hahn ,  David Probst ,  Randal Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  A61B5/145 ,  A61B5/1468

Abstract: Processes for fabricating physiological characteristic sensor devices are disclosed here. An embodiment of the fabrication process forms a circuit pattern on a base substrate, where the circuit pattern includes circuit layouts for multiple die locations. Component stacks are mounted to the circuit layouts. Each stack has features and components to provide processing and wireless communication functionality for obtained sensor data. An enclosure structure is formed overlying the base substrate to individually cover and enclose each of the component stacks. Sensor elements are fabricated on another surface of the substrate such that each sensor element has electrodes coupled to conductive plug elements formed through the substrate, and such that each sensor element corresponds to one die location. Next, the substrate is separated into physically discrete sensor device components.

公开(公告)号：US12232842B2

公开(公告)日：2025-02-25

申请号：US18047861

申请日：2022-10-19

Applicant: Medtronic MiniMed, Inc.

Inventor： Daniel Hahn ,  David L. Probst ,  Randal C. Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1486 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

公开(公告)号：US11490811B2

公开(公告)日：2022-11-08

申请号：US17112394

申请日：2020-12-04

Applicant: Medtronic MiniMed, Inc.

Inventor： Daniel Hahn ,  David L. Probst ,  Randal C. Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1486 ,  H01L23/31

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.

公开(公告)号：US20190090742A1

公开(公告)日：2019-03-28

申请号：US15716424

申请日：2017-09-26

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Daniel Hahn ,  David Probst ,  Randal Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  A61B5/145 ,  A61B5/1468

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.