公开(公告)号：US20160032440A1

公开(公告)日：2016-02-04

申请号：US14766185

申请日：2014-02-13

Applicant: MESSIER-BUGATTI-DOWTY

Inventor： Francis MONERIE-MOULIN ,  Regis GAYDU

IPC: C23C4/12 ,  G01B21/30 ,  C23C4/06 ,  C23C4/18 ,  C23C4/02

CPC classification number: C23C4/02 ,  C23C4/06 ,  C23C4/129 ,  C23C4/18 ,  G01B21/30

Abstract: A method of fabricating a part (1) comprising a metal substrate (Sub) at least partially covered in a coating layer (Rev). The method comprises: preparing (A) a surface of the substrate (Sub) to obtain a prepared surface of roughness Ra lying in the range 0.6 μm to 1.6 μm, and; forming (C) the coating layer (Rev) on the prepared surface of the substrate, this coating layer (Rev) being formed by spraying, using an HVOF type spraying method to spray a powder mixture containing grains (G) of metal carbide, the grains (G) having dimensions that are strictly less than 1 μm and the thickness (Epmin) of the coating layer (Rev) as formed in this way being less than 50 μm; then finishing at least one surface of said coating layer (Rev) by polishing (D) in such a manner as to ensure that its roughness Ra is less than 1.6 μm.

Abstract translation: 一种制造包括至少部分地覆盖在涂层（Rev）中的金属基底（Sub）的部分（1）的方法。 该方法包括：制备（A）基材表面（Sub），得到准备的表面粗糙度Ra在0.6μm至1.6μm的范围内; 在基材的制备表面上形成（C）涂层（Rev），通过使用HVOF型喷涂法喷涂含有金属碳化物颗粒（G）的粉末混合物，通过喷涂形成该涂层（Rev）， 尺寸严格小于1μm的颗粒（G）和以这种方式形成的涂层（Rev）的厚度（Epmin）小于50μm; 然后通过抛光（D）来完成所述涂层（Rev）的至少一个表面，以确保其粗糙度Ra小于1.6μm。