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公开(公告)号：US12092449B2
公开(公告)日：2024-09-17
申请号：US17682263
申请日：2022-02-28
发明人： Kazuya Konada , Takashi Yanagi , Ryosuke Yamazaki
IPC分类号： G01B21/30 , B60G17/016 , B60G17/0165 , G01S13/08
CPC分类号： G01B21/30 , G01S13/08 , B60G17/0161 , B60G17/0162 , B60G17/0165 , B60G2400/821 , B60G2401/21 , B60G2600/172
摘要： A preview road surface detection device of a vehicle of the present invention includes: a distance sensor that is disposed in a vehicle member and detects a distance to a measurement point on a road surface nearer to a front part of the vehicle, corresponding to at least a central portion of a contact patch to the road surface of a wheel of the vehicle; and a distance calculator that calculates a road surface distance from the vehicle member to the measurement point, based on a value detected by the distance sensor. A displacement of the road surface nearer to the front part of the vehicle is detected as a road surface condition. The displacement of the road surface is calculated from the road surface distance and a vehicle height of the vehicle member when the distance sensor detects the distance.
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公开(公告)号：US20240271930A1
公开(公告)日：2024-08-15
申请号：US18168287
申请日：2023-02-13
IPC分类号： G01B21/30
CPC分类号： G01B21/30
摘要： A vehicle system of a vehicle may include comprising a controller programmed to obtain rotational speeds of a plurality of wheels of the vehicle at a plurality of time steps, determine a difference between speeds of one or more front wheels of the vehicle and speeds of one or more rear wheels of the vehicle at the plurality of time steps to generate wheel speed differential data, perform a wavelet transform of the wheel speed differential data to generate a continuous wavelet transform spectrum, identify one or more hot spots in the continuous wavelet transform spectrum comprising a plurality of data points having an amplitude within a predetermined frequency range greater than a predetermined detection threshold, and determine locations of one or more speed bumps based on the identified one or more hot spots.
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公开(公告)号：US20240255284A2
公开(公告)日：2024-08-01
申请号：US18340845
申请日：2023-06-24
申请人： University of Pittsburgh - Of the Commonwealth System of Higher Education , Albert-Ludwigs-Universität Freiburg Freiburg (DE)
发明人： Tevis Jacobs , Lars Pastewka , Paul Strauch , Antoine Sanner , Michael Röttger
IPC分类号： G01B21/30
CPC分类号： G01B21/30
摘要： A method of characterizing a surface topography includes determining scale-dependent parameters. Each of the scale-dependent parameters represents a statistical characterization of a distribution of at least one of a first-order or higher-order derivative of surface height or h determined from one or more measurements of the surface at each of multiple distance scales. For at least one of the one or more measurements, the first-order or higher-order derivative of surface height is determined at the multiple distance scales in real space defined via a scaling factor η which is greater than or equal to 1 and which is multiplied by the smallest possible distance scale or resolution provided by the at least one of the one or more measurements.
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公开(公告)号：US11928178B2
公开(公告)日：2024-03-12
申请号：US17268326
申请日：2019-08-01
发明人： Masato Ohnishi
摘要： A wafer is prepared, and a thickness shape of the prepared wafer at each position in a radial direction is measured for each of a predetermined number of angles into which 360 degrees of a circumference around the center of the wafer are divided. The thickness shape obtained by a measuring machine for each angle is approximated with a sixth or higher order polynomial, and a function of the wafer thickness at the position in the radial direction is created. The thickness shape outputted by the measuring machine and a thickness shape outputted by the function are compared with each other, and an error on the entire surface of the wafer is confirmed to be not greater than a predetermined error. After the confirmation, information of the function for each angle is attached to the wafer as data representing the wafer shape and supplied to a user.
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公开(公告)号：US11774241B2
公开(公告)日：2023-10-03
申请号：US17552301
申请日：2021-12-15
发明人： Wei-Shan Hu , Dong Gui , Jang Jung Lee , Che-Liang Li , Duen-Huei Hou , Wen-Chung Liu
摘要： Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
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公开(公告)号：US20230169858A1
公开(公告)日：2023-06-01
申请号：US18073332
申请日：2022-12-01
发明人： Sami Mekki , Mustapha AMARA , Songyu Yuan , Yutong Zhu , Zhixuan Wei , Xueming Peng
IPC分类号： G08G1/0962 , G01B21/30 , B60Q9/00
CPC分类号： G08G1/09626 , G01B21/30 , B60Q9/00
摘要： A sensing apparatus for detecting speed bumps or potholes on a road is disclosed. The sensing apparatus comprises a telemetric sensing system configured to collect a plurality of position vectors by telemetric sensing of a road surface, wherein each position vector extends from a common origin to a respective point on the road surface and wherein each position vector has a length and a direction. The sensing apparatus further comprises a processing circuitry configured to detect a road flatness exception by evaluating the lengths of the position vectors. Thus, an improved apparatus for detecting road irregularities such as speed bumps or potholes on a road is provided. The sensing apparatus remains functional in low light conditions, e.g., at night, and also in the presence of reverberation of the vehicle. In an implementation form, the telemetric sensing system may comprise one or more radar sensors and/or one or more lidar sensors for collecting the plurality of position vectors using radar and/or lidar measurements.
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公开(公告)号：US20180120078A1
公开(公告)日：2018-05-03
申请号：US15404776
申请日：2017-01-12
CPC分类号： G01B5/20 , G01B3/18 , G01B5/30 , G01B11/306 , G01B21/30
摘要： A flatness measurement device includes a movement platform, a standard component, a first flatness measuring device, a second flatness measuring device and a processor. The movement platform is used for driving a to-be-measured object to move. The standard component and the movement platform move together. The first flatness measuring device is used for measuring a first flatness information of the to-be-measured object when the to-be-measured object moves. The second flatness measuring device is used for measuring a second flatness information of the standard component when the standard component moves. A flatness information of the to-be-measured object is obtained by deducting the second flatness information from the first flatness information by the processor.
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公开(公告)号：US09958261B2
公开(公告)日：2018-05-01
申请号：US15513524
申请日：2015-09-18
申请人： FOGALE NANOTECH
发明人： Gilles Fresquet
CPC分类号： G01B11/2441 , G01B9/0203 , G01B11/303 , G01B21/30 , G01B2210/56 , G01N21/9501 , G01N2021/8841 , H01L22/12
摘要： A device or apparatus is provided for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath the first surface including (i) profilometry apparatus arranged in order to carry out measurements of shape on the first surface of the wafer according to at least one measurement field; (ii) imaging apparatus facing the profilometry apparatus and arranged in order to acquire a reference image of the structures on or through a second surface of the wafer opposite to the first surface according to at least one imaging field; the profilometry apparatus and said imaging apparatus being arranged so that the measurement and imaging fields are referenced in position within a common frame of reference.A method is also provided to be implemented in this device or this apparatus.
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公开(公告)号：US20180038688A1
公开(公告)日：2018-02-08
申请号：US15312251
申请日：2015-11-27
发明人： Shaohui Zhang , Di Xu , Yinong Li , Meijian Bai , Fuxiang Li
IPC分类号： G01B21/30
CPC分类号： G01B21/30 , A01G25/167 , G01N2033/245
摘要： The present invention belongs to the technical field of irrigation and water conservancy, and discloses a method for acquiring anisotropic basin surface roughness and use thereof. The method includes: preselecting two experimental strip fields respectively parallel to length direction and width direction of a target basin, to respectively acquire first surface water flow advancing process data of the two experimental strip fields, where the target basin may be regarded as a square-shaped field; acquiring two pieces of isotropic basin surface roughness respectively by using one-dimensional complete hydrodynamic model for basin irrigation according to the surface water flow advancing process data; and substituting the isotropic basin surface roughness into an elliptic equation that anisotropic basin surface roughness satisfies, to solve anisotropic basin surface roughness of the target basin, the anisotropic basin surface roughness including basin surface roughness components parallel to and perpendicular to shallow furrows on basin surface and crop planting direction in the target basin. The anisotropic basin surface roughness can truly reflect the resistance of the basin surface against the water flow, thereby improving simulation precision of surface irrigation hydrodynamics, and acquiring more accurate irrigation performance indexes.
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公开(公告)号：US20170299376A1
公开(公告)日：2017-10-19
申请号：US15513524
申请日：2015-09-18
申请人： FOGALE NANOTECH
发明人： Gilles FRESQUET
CPC分类号： G01B11/2441 , G01B9/0203 , G01B11/303 , G01B21/30 , G01B2210/56 , G01N21/9501 , G01N2021/8841 , H01L22/12
摘要： A device or apparatus is provided for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath the first surface including (i) profilometry apparatus arranged in order to carry out measurements of shape on the first surface of the wafer according to at least one measurement field; (ii) imaging apparatus facing the profilometry apparatus and arranged in order to acquire a reference image of the structures on or through a second surface of the wafer opposite to the first surface according to at least one imaging field; the profilometry apparatus and said imaging apparatus being arranged so that the measurement and imaging fields are referenced in position within a common frame of reference.A method is also provided to be implemented in this device or this apparatus.
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