公开(公告)号：US20210114751A1

公开(公告)日：2021-04-22

申请号：US17254313

申请日：2018-06-27

申请人： Mitsubishi Electric Corporation

发明人： Takashi MIYAMOTO ,  Naoki YASUDA ,  Shinichi OKADA ,  Ryota KUSANO

IPC分类号： B64G1/42 ,  H05K1/18 ,  H05K7/12

摘要： A power supply device (104-1) includes a substrate (20) on which an electric component (25) is mounted, a chassis (10) having a chassis surface (11) and a threaded part (10a), a chassis-side resin part (91) connected to a back surface (20a) and the chassis surface (11), a fixation screw (29), and an insulating member (60). The fixation screw (29) fixes both the electric component (25) and the substrate (20) to the chassis (10) by screw-coupling an end part (29c) of the fixation screw (29), exposed in a direction toward the chassis (10) from an open hole formed through the insulating member (60), to the threaded part (10a) of the chassis (10). In addition, the fixation screw (29) brings the electric component (25) and the chassis (10) into electrical noncontact with each other by being placed in an open hole of the insulating member (60).

公开(公告)号：US20200060023A1

公开(公告)日：2020-02-20

申请号：US16348776

申请日：2017-12-28

申请人： Mitsubishi Electric Corporation

发明人： Takashi MIYAMOTO ,  Naoki YASUDA ,  Shinichi OKADA ,  Hiroyuki OSUGA ,  Ryota KUSANO

IPC分类号： H05K1/14 ,  H05K7/20

摘要： A power supply device (100-1) includes: a substrate (20) on which an electric component (25) is mounted; a chassis (10) including a chassis surface (11) to be a surface facing one surface (20a) of the substrate (20); and cured insulating resin (27-1) to be placed between the one surface (20a) of the substrate (20) and the chassis surface (11) so as to be connected to the one surface (20a) and the chassis surface (11), the cured insulating resin (27-1) having a thermal conductivity between 1 W/mK and 10 W/mK inclusive.

公开(公告)号：US20160172921A1

公开(公告)日：2016-06-16

申请号：US14904730

申请日：2013-11-08

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Manabu YOSHINORI ,  Atsushi SAKAUE ,  Tatsuro HINO ,  Hironori TSUIKI ,  Shinichi OKADA ,  Hiroki SHIOTA ,  Masaya INOUE ,  Shogo OKAMOTO ,  Shinji NISHIMURA ,  Akira HASHIMOTO ,  Shinkichi SAWA ,  Yutaka IKURA ,  Ryuichi KITORA

IPC分类号： H02K3/34 ,  H02K1/16

CPC分类号： H02K3/34 ,  H02K1/16 ,  H02K1/165 ,  H02K3/28 ,  H02K3/345 ,  H02K15/12

摘要： A side surface at the outside of a plurality of teeth portions of one separated core is faced to a side surface of teeth portions of an adjacent separated core, so as to form a second slot which is straddled between the adjacent separated cores, and a first slot is formed by a plurality of teeth portions of one separated core, and a width size of the first slot is identical to a width size of the second slot, and coil conductor storage space is formed in the first slot via a first insulating component, and coil conductor storage space is formed in the second slot via a second insulating component, and a thickness size of the first insulating component is different from a thickness size of the second insulating component.

摘要翻译： 一个分离的芯的多个齿部分的外侧的侧表面相对于相邻的分离的芯的齿部分的侧表面，以形成跨在相邻的分离的芯之间的第二槽，并且第一 槽由一个分离的芯的多个齿部分形成，并且第一槽的宽度尺寸与第二槽的宽度尺寸相同，并且线圈导体存储空间经由第一绝缘构件形成在第一槽中， 并且经由第二绝缘部件在第二槽中形成线圈导体存储空间，并且第一绝缘构件的厚度尺寸与第二绝缘构件的厚度尺寸不同。