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公开(公告)号：US20210114751A1
公开(公告)日：2021-04-22
申请号：US17254313
申请日：2018-06-27
发明人： Takashi MIYAMOTO , Naoki YASUDA , Shinichi OKADA , Ryota KUSANO
摘要： A power supply device (104-1) includes a substrate (20) on which an electric component (25) is mounted, a chassis (10) having a chassis surface (11) and a threaded part (10a), a chassis-side resin part (91) connected to a back surface (20a) and the chassis surface (11), a fixation screw (29), and an insulating member (60). The fixation screw (29) fixes both the electric component (25) and the substrate (20) to the chassis (10) by screw-coupling an end part (29c) of the fixation screw (29), exposed in a direction toward the chassis (10) from an open hole formed through the insulating member (60), to the threaded part (10a) of the chassis (10). In addition, the fixation screw (29) brings the electric component (25) and the chassis (10) into electrical noncontact with each other by being placed in an open hole of the insulating member (60).
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公开(公告)号：US20200032046A1
公开(公告)日：2020-01-30
申请号：US16086126
申请日：2016-12-21
发明人： Azusa OSAWA , Takahiro MABUCHI , Naoki YASUDA
IPC分类号： C08L63/00 , C08G59/24 , C08G59/22 , C08K3/36 , C08K9/04 , H02K3/30 , C08G59/26 , C08G59/42 , C08K5/3445
摘要： A curable composition (X) includes: an epoxy resin (A); a curing agent (B); a curing promoter (C); and hydrophilic inorganic particles (D). The epoxy resin (A) includes a first epoxy resin (a1) and a second epoxy resin (a2). The first epoxy resin (a1) is a chain aliphatic epoxy resin having a hydrophilic group, and an aqueous dissolution rate of the first epoxy resin (a1) is not less than 20 mass % and not more than 99 mass %. The second epoxy resin (a2) includes at least one selected from the group consisting of a cyclic aliphatic epoxy resin, an aromatic epoxy resin and a heterocyclic epoxy resin.
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公开(公告)号：US20190144703A1
公开(公告)日：2019-05-16
申请号：US16098268
申请日：2017-04-06
发明人： Satoru SATO , Naoki YASUDA , Nobuo YOKOMURA , Ryoko KAWANO , Manabu YOSHIMURA , Shinichiro NAKAUCHI
IPC分类号： C09D163/00 , C09D7/62 , C09D7/40 , C09D7/45 , C09D7/20 , H02B13/045
摘要： A coating material of the present invention includes an insulating resin, and dispersion particles dispersed in the insulating resin. The dispersion particle includes a core particle containing zinc oxide as a main component and having nonlinear resistance, and a resin layer covering the surface of the core particle and having an average thickness being less than or equal to 5.0 μm. The coating material of the present invention is a coating material for coating an inner surface of a ground tank of a gas insulated switchgear.
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公开(公告)号：US20200060023A1
公开(公告)日：2020-02-20
申请号：US16348776
申请日：2017-12-28
发明人： Takashi MIYAMOTO , Naoki YASUDA , Shinichi OKADA , Hiroyuki OSUGA , Ryota KUSANO
摘要： A power supply device (100-1) includes: a substrate (20) on which an electric component (25) is mounted; a chassis (10) including a chassis surface (11) to be a surface facing one surface (20a) of the substrate (20); and cured insulating resin (27-1) to be placed between the one surface (20a) of the substrate (20) and the chassis surface (11) so as to be connected to the one surface (20a) and the chassis surface (11), the cured insulating resin (27-1) having a thermal conductivity between 1 W/mK and 10 W/mK inclusive.
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公开(公告)号：US20210183535A1
公开(公告)日：2021-06-17
申请号：US17082751
申请日：2020-10-28
摘要： In the insulation sheet, an insulation resin layer made of a thermosetting resin composition in an uncured or semi-cured state is formed on one or each of both surfaces of the base material. The thermosetting resin composition contains: a thermosetting resin (A) that is in solid form at 25° C.; a thermosetting resin (B) that is in liquid form at 25° C.; a latent curing agent that is unreactive at 60° C. or lower; and an inorganic filler having a maximum particle diameter smaller than a film thickness of the insulation resin layer and having an average particle diameter smaller than 0.5 times the film thickness. The insulation resin layer of the insulation sheet is efficiently compressed into a predetermined thickness by pressure application at normal temperature and permeates a gap between a stator core and a stator coil by heating during curing treatment, whereby both members can be insulated and fixed.
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公开(公告)号：US20210130603A1
公开(公告)日：2021-05-06
申请号：US16935320
申请日：2020-07-22
发明人： Naoki YASUDA , Shiori NATORI , Kazuya HASEGAWA , Shogo OKAMOTO
摘要： The thermosetting resin composition is used for a sheet-form insulating varnish to be disposed in a gap between insulation target members, and contains: a thermosetting resin (A) that is in solid form at 25° C.; a thermosetting resin (B) that is in liquid form at 25° C.; a latent curing agent that is unreactive at 60° C. or lower; and an inorganic filler having a maximum particle diameter smaller than a dimension of the gap and having an average particle diameter smaller than 0.5 times the dimension of the gap. 30 parts by mass to 70 parts by mass of the thermosetting resin (A) is contained per a total of 100 parts by mass of the thermosetting resin (A) and the thermosetting resin (B). A volume ratio of the inorganic filler to an entirety of the composition is not higher than 50%.
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7.发明申请公开(公告)号：US20180258313A1
公开(公告)日：2018-09-13
申请号：US15761140
申请日：2015-10-08
发明人： Naoki YASUDA , Shigeyuki YAMAMOTO , Toshifumi KANRI , Takahiro TSUTSUMI , Masashi ONO , Kosuke SANO , Yukio HIDAKA
IPC分类号： C09D163/00 , H02K3/30 , H02K15/12
CPC分类号： C09D163/00 , C08G59/00 , C08G59/1466 , C08G59/68 , C08J3/24 , C08K5/14 , C08L33/04 , C08L63/00 , C09D163/10 , H01B3/40 , H02K3/30 , H02K3/44 , H02K7/14 , H02K15/12 , C08K5/0025
摘要： The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40° C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.
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