Silicone composition for sealing semiconductor
    3.
    发明授权
    Silicone composition for sealing semiconductor 有权
    硅胶密封半导体组合物

    公开(公告)号:US09564562B2

    公开(公告)日:2017-02-07

    申请号:US14730810

    申请日:2015-06-04

    摘要: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.Specifically the polyorganosiloxane (A) is prepared by block or graft polymerization and equilibration reaction of three specific, different, organosiloxanes including a branched siloxane, a linear siloxane and a cyclic siloxane.

    摘要翻译: 具体地说,聚有机硅氧烷(A)通过包括支链硅氧烷,直链硅氧烷和环状硅氧烷在内的三种特定不同的有机硅氧烷的嵌段或接枝聚合和平衡反应来制备。