公开(公告)号：US20040215409A1

公开(公告)日：2004-10-28

申请号：US10420616

申请日：2003-04-22

Applicant: MOTOROLA, INC.

Inventor： Hakeem Adewole ,  Paul Brazis ,  Daniel Gamota ,  Jie Zhang

IPC: G06F019/00

CPC classification number: G06K19/0723 ,  G06K19/0717 ,  G06K19/07703

Abstract: An organic semiconductor product state monitor attached to a product receives a product usefulness input, which, along with the product predetermined usefulness limit, is used to determine an indicator command to indicate a state of usefulness of the product. An organic circuit is formed and placed on a product with a power supply to control the circuit operation.

Abstract translation: 附加到产品的有机半导体产品状态监视器接收产品有用性输入，其与产品预定有用限制一起用于确定指示产品有用状态的指示符命令。 形成有机电路并放置在具有电源的产品上以控制电路操作。

公开(公告)号：US20040048445A1

公开(公告)日：2004-03-11

申请号：US10236619

申请日：2002-09-06

Applicant: Motorola, Inc.

Inventor： Marc Chason ,  Paul Brazis ,  Krishna Kalyanasundaram ,  Daniel Gamota

IPC: H01L021/76

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.