PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD, AND GUIDING PLATE STRUCTURE THEREIN

    公开(公告)号:US20240393367A1

    公开(公告)日:2024-11-28

    申请号:US18645592

    申请日:2024-04-25

    Abstract: A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole to provide compensating impedance between the guide-hole pair, improve impedance matching when probing the device under test with the probe pair, and reduce return loss between the probe head and the device under test.

    PROBE SYSTEM FOR TESTING DEVICE UNDER TEST INTEGRATED IN SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD AND GUIDE PLATE STRUCTURE THEREOF

    公开(公告)号:US20240402218A1

    公开(公告)日:2024-12-05

    申请号:US18806888

    申请日:2024-08-16

    Abstract: A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole. The extension hole intersects with at least one of the first guide holes and is located substantially between the probe pair on the first guide plate.

    PROBE SYSTEM FOR TESTING OF DEVICES UNDER TEST INTEGRATED ON A SEMICONDUCTOR WAFER, AND PROBE CARD, PROBE HEAD, AND GUIDING PLATE STRUCTURE THEREIN

    公开(公告)号:US20240393368A1

    公开(公告)日:2024-11-28

    申请号:US18645531

    申请日:2024-04-25

    Abstract: A probe system and a probe card, a probe head and a guide plate structure thereof are described herein. The probe head includes a plurality of probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end is configured to abut a contact pad of the device under test. The second end is configured to abut a contact pad of a board of the probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a pair of first guide holes for a pair of probes to pass through, and the pair of first guide holes are configured to slidably accommodate the pair of probes. The material between the pair of first guide holes in the guide plate has a relative dielectric constant not greater than 6, so as to reduce the return loss between the probe head and the device under test.

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