公开(公告)号：US20210333219A1

公开(公告)日：2021-10-28

申请号：US16858711

申请日：2020-04-27

Applicant: MPI Corporation

Inventor： Frank FEHRMANN ,  Chien-Hung CHEN ,  Ching-Yang YANG

IPC: G01N21/95 ,  G01C3/02 ,  G02B21/00

Abstract: A method of determining a first distance between a probe and a wafer held by a wafer probe station includes adjusting a microscope at a specific magnification; moving the microscope perpendicularly relative to a chuck to focus on the chuck to obtain a clear image of the chuck; defining a specific position of the microscope after the clear image of the chuck is obtained; maintaining the specific magnification of the microscope and moving the microscope perpendicularly relative to the chuck from the specific position by a travelling distance to focus on the probe to obtain a clear image of the probe; and determining the travelling distance minus a thickness of a wafer to be placed on a side of the chuck facing to the microscope as the first distance between the probe and the wafer.

公开(公告)号：US20140016124A1

公开(公告)日：2014-01-16

申请号：US13941009

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai CHANG ,  Chin-Yi TSAI ,  Chiu-Kuei CHEN ,  Chen-Chih YU ,  Chien-Chang LAI ,  Chin-Tien YANG ,  Hui-Pin YANG ,  Keng-Shieng CHANG ,  Yun-Ru HUANG ,  Chien-Hung CHEN

IPC: G01N21/88

CPC classification number: G01N21/88 ,  G01R1/06794 ,  G02B7/022 ,  G02B7/023

Abstract: An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening.

Abstract translation: 光学检查装置包括具有至少一个第一开口的电路板，设置在电路板的顶表面或底表面上的安装板，并且具有分别对应于至少一个第一开口的至少一个第二开口，至少一个透镜 容纳在所述至少一个第二开口中的至少一个透镜保持器，以及至少一个探针模块，其布置在所述安装板的底表面或所述电路板的底表面上，所述至少一个探针模块分别对应于所述至少一个透镜保持器，并且具有与 电路板。 每个透镜保持器具有用于容纳透镜的容纳部，并且可操作以在相应的第二开口中进行位置调整运动。

公开(公告)号：US20220005721A1

公开(公告)日：2022-01-06

申请号：US16920381

申请日：2020-07-02

Applicant: MPI Corporation

Inventor： Yung-Chin LIU ,  Chien-Hung CHEN ,  Men-Han LEE

IPC: H01L21/68 ,  G06T7/00 ,  G06T7/73 ,  H01L21/687

Abstract: A method of aligning a wafer includes defining a reference direction for aligning the wafer; capturing an image of the wafer held on a chuck; using an identifying module to analyze a straight line on the image of the wafer; calculating an offset angle between the straight line and the reference direction; and calibrating the offset angle to align the straight line with the reference direction by way rotating the chuck.

公开(公告)号：US20210382108A1

公开(公告)日：2021-12-09

申请号：US16892267

申请日：2020-06-03

Applicant: MPI Corporation

Inventor： Stojan KANEV ,  Yu-Hsun HSU ,  Chien-Hung CHEN

IPC: G01R31/319 ,  G01K7/01 ,  G01R31/28 ,  G01C3/02

Abstract: A method for compensating to a first distance between a probe tip and a device under test (DUT) after a temperature change of the DUT includes: capturing a first image having the probe and its reflected image on a reflective surface of the DUT at a first temperature; measuring a second distance between a reference point of the probe and its reflected image; changing the first temperature of the DUT to a second temperature; capturing a second image having the probe and its reflected image on the reflective surface at the second temperature; measuring a third distance between the reference point of the probe and its reflected image; dividing the difference between the third and the second distances by two to obtain a fourth distance; and determining a relative position between the probe and the DUT by the fourth distance to compensate to the first distance.

公开(公告)号：US20170299629A1

公开(公告)日：2017-10-19

申请号：US15460246

申请日：2017-03-16

Applicant: MPI Corporation

Inventor： Chin-Yi TSAI ,  Chien-Hung CHEN

IPC: G01R1/067

CPC classification number: G01R1/06777

Abstract: A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.