公开(公告)号：US20140290053A1

公开(公告)日：2014-10-02

申请号：US14224727

申请日：2014-03-25

Applicant: MPI CORPORATION

Inventor： Kuan-Chun CHOU ,  Huo-Kang HSU ,  Hui-Pin YANG ,  Chien-Kuei WANG

IPC: G01R3/00

CPC classification number: G01R3/00 ,  G01R1/07378 ,  Y10T29/49128

Abstract: A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained.

Abstract translation: 一种制造用于探针卡的空间变压器的方法包括以下步骤：在第一基板上安装和电连接第二基板，在每个第二基板上形成具有通孔的绝缘层，并在通孔中形成导电块， 分别。 由于在第二基板安装到第一基板之后形成导电块，因此在安装期间第一和第二基板的任何意外的相对位移对于导电块的位置是不利的。 此外，可以进一步执行导电块的平坦化步骤。 因此，在探针与这样获得的空间变换器的导电块连接之后，探针的位置和平面度可能不需要调整。

公开(公告)号：US20150028911A1

公开(公告)日：2015-01-29

申请号：US14338797

申请日：2014-07-23

Applicant: MPI Corporation

Inventor： Chia-Tai CHANG ,  Hui-Pin YANG

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06772 ,  G01R1/07307 ,  G01R1/07342

Abstract: A high frequency probe card for probing a photoelectric device includes a substrate having a first opening and at least one first through hole, an interposing plate disposed on the substrate and having a second opening and at least one second through hole, a circuit board disposed on the interposing plate and having a third opening and at least one third through hole, and a probe module mounted to the substrate and having at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure passing through the at least one first, second and third through holes and being electrically connected with a signal pad and a ground pad of the circuit board, respectively. The first, second and third openings are communicated with each other for light transmission.

Abstract translation: 用于探测光电装置的高频探针卡包括具有第一开口和至少一个第一通孔的基板，设置在基板上的中间板，具有第二开口和至少一个第二通孔，电路板设置在 所述插入板具有第三开口和至少一个第三通孔，以及安装在所述基板上并具有至少一个接地探针和至少一个具有信号传输结构和接地结构的高频阻抗匹配探头的探针模块 穿过所述至少一个第一，第二和第三通孔并分别与所述电路板的信号焊盘和接地焊盘电连接。 第一，第二和第三开口彼此连通用于透光。

公开(公告)号：US20140015561A1

公开(公告)日：2014-01-16

申请号：US13941210

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai CHANG ,  Chin-Yi TSAI ,  Chiu-Kuei CHEN ,  Chen-Chih YU ,  Chien-Chang LAI ,  Chin-Tien YANG ,  Hui-Pin YANG ,  Keng-Shieng CHANG ,  Yun-Ru HUANG

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06772

Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe.

Abstract translation: 高频探针卡包括具有至少一个第一开口的至少一个基板，设置在所述至少一个基板上的插入板，并且具有至少一个对应于所述至少一个第一开口的第二开口，布置在插入件上的电路板 并且具有对应于所述至少一个第一和第二开口的第三开口，以及至少一个探针模块，其包括至少一个N型接地探针和至少一个穿过相应基板的高频信号探针，所述插入板和 第三开口并与电路板电连接。 每个高频信号探头包括N型信号探头和对应于N型信号探针的第一导体，并与N型接地探针电连接。 绝缘层设置在第一导体和N型信号探头之间。

公开(公告)号：US20210048451A1

公开(公告)日：2021-02-18

申请号：US16990612

申请日：2020-08-11

Applicant: MPI CORPORATION

Inventor： Chin-Tien YANG ,  Hui-Pin YANG ,  Shang-Jung HSIEH ,  Tsung-Yi CHEN ,  Yu-Hao CHEN ,  Jhin-Ying LYU

IPC: G01R1/067 ,  G01R1/073

Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.

公开(公告)号：US20140016124A1

公开(公告)日：2014-01-16

申请号：US13941009

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai CHANG ,  Chin-Yi TSAI ,  Chiu-Kuei CHEN ,  Chen-Chih YU ,  Chien-Chang LAI ,  Chin-Tien YANG ,  Hui-Pin YANG ,  Keng-Shieng CHANG ,  Yun-Ru HUANG ,  Chien-Hung CHEN

IPC: G01N21/88

CPC classification number: G01N21/88 ,  G01R1/06794 ,  G02B7/022 ,  G02B7/023

Abstract: An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening.

Abstract translation: 光学检查装置包括具有至少一个第一开口的电路板，设置在电路板的顶表面或底表面上的安装板，并且具有分别对应于至少一个第一开口的至少一个第二开口，至少一个透镜 容纳在所述至少一个第二开口中的至少一个透镜保持器，以及至少一个探针模块，其布置在所述安装板的底表面或所述电路板的底表面上，所述至少一个探针模块分别对应于所述至少一个透镜保持器，并且具有与 电路板。 每个透镜保持器具有用于容纳透镜的容纳部，并且可操作以在相应的第二开口中进行位置调整运动。

公开(公告)号：US20140016123A1

公开(公告)日：2014-01-16

申请号：US13940870

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai CHANG ,  Chin-Yi TSAI ,  Chiu-Kuei CHEN ,  Chen-Chih YU ,  Chien-Chang LAI ,  Chin-Tien YANG ,  Hui-Pin YANG ,  Keng-Shieng CHANG ,  Yun-Ru HUANG

IPC: G01N21/88 ,  G01R1/073

CPC classification number: G01N21/88 ,  G01R1/04 ,  G01R1/06711 ,  G01R1/073 ,  G01R1/07342 ,  H01L21/68

Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.

Abstract translation: 探针保持结构包括基板和多个保持模块。 基板具有围绕开口的周边布置的开口和多个槽。 保持模块分别与凹槽连接。 每个保持模块包括固定构件和多个探针。 固定构件与相应的凹槽连接。 探针与固定部件连接并通过相应的凹槽。 探头保持结构与具有透镜的透镜调节机构组合，以形成用于测试芯片的电特性的光学检查装置。

公开(公告)号：US20250147072A1

公开(公告)日：2025-05-08

申请号：US18932728

申请日：2024-10-31

Applicant: MPI CORPORATION

Inventor： Chin-Tien YANG ,  Hui-Pin YANG

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe card includes a circuit board, a space transformer, and a probe head. The probe head includes a probe pair, an insulating spacer, and a guide plate. Each probe in the probe pair includes a head portion, a tail portion, and a body portion located between the head portion and the tail portion and extending according to a longitudinal development axis. The body portion of each probe can deflect and deform on the longitudinal development axis when a load is applied to the probe. The guide plate includes a guide hole, and both probes of the probe pair pass through the guide hole. The hole diameter of the guide hole is larger than the hole diameter of the ground guide hole adjacent to the guide hole. The insulating spacer is coupled between the two probes, thereby maintaining the relative position between the two probes.

公开(公告)号：US20210048452A1

公开(公告)日：2021-02-18

申请号：US16990283

申请日：2020-08-11

Applicant: MPI CORPORATION

Inventor： Hui-Pin YANG ,  Shang-Jung HSIEH ,  Yu-Wen CHOU ,  Ching-Fang YU ,  Huo-Kang HSU ,  Chin-Tien YANG

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.