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公开(公告)号：US20210156907A1
公开(公告)日：2021-05-27
申请号：US16950324
申请日：2020-11-17
Applicant: MPI CORPORATION
Inventor： WEN PIN CHUANG , YI CHING LO
Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.
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公开(公告)号：US20210156903A1
公开(公告)日：2021-05-27
申请号：US17039239
申请日：2020-09-30
Applicant: MPI CORPORATION
Inventor： WEN PIN CHUANG , YI CHING LO , HAO DUAN
Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.
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