公开(公告)号：US09823272B2

公开(公告)日：2017-11-21

申请号：US14162766

申请日：2014-01-24

Applicant: MPI Corporation

Inventor： Ming-Chi Chen ,  Tien-Chia Li ,  Dai-Jin Yeh ,  Tsung-Yi Chen ,  Chien-Kuei Wang

IPC: G01R31/02 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01R1/0735 ,  G01R1/06733 ,  G01R1/07314

Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.