公开(公告)号：US11703541B2

公开(公告)日：2023-07-18

申请号：US17524788

申请日：2021-11-12

Applicant: MPI Corporation

Inventor： Volker Hansel ,  Sebastian Giessmann ,  Frank Fehrmann ,  Chien-Hung Chen

IPC: G01R31/28 ,  H01L21/66

CPC classification number: G01R31/2891 ,  G01R31/2887 ,  H01L22/12

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

公开(公告)号：US20220155365A1

公开(公告)日：2022-05-19

申请号：US17524788

申请日：2021-11-12

Applicant: MPI Corporation

Inventor： Volker Hansel ,  Sebastian Giessmann ,  Frank Fehrmann ,  Chien-Hung Chen

IPC: G01R31/28 ,  H01L21/66

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

公开(公告)号：US11693050B2

公开(公告)日：2023-07-04

申请号：US17524833

申请日：2021-11-12

Applicant: MPI Corporation

Inventor： Volker Hansel ,  Sebastian Giessmann ,  Frank Fehrmann ,  Chien-Hung Chen

IPC: G01R31/28 ,  G01R1/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  H01L21/66

CPC classification number: G01R31/2891 ,  G01R31/2887 ,  H01L22/12

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

公开(公告)号：US10996239B1

公开(公告)日：2021-05-04

申请号：US16872390

申请日：2020-05-12

Applicant: MPI Corporation

Inventor： Ingo Berg ,  Chien-Hung Chen ,  Frank Fehrmann ,  Sebastian Giessmann

IPC: G01Q20/02 ,  G01Q70/06

Abstract: A method of positioning probe tips relative to pads includes: focusing on each of the probe tips in a first image as viewed by a microscope and collecting the coordinates of the corresponding probe tip relative to a first reference point in the first image; focusing on each of the pads in a second image as viewed by the microscope and collecting the coordinates of the corresponding pad relative to a second reference point in the second image, a relative position of the second reference point to the first reference point being predetermined; matching the pads with the probe tips when the quantity of the probe tips and the pads are equal while minimizing a maximum value of the distances calculated between each of the probe tips and the corresponding pad; and moving the probe tips to touch the pads with the maximum value minimized.

公开(公告)号：US20220155366A1

公开(公告)日：2022-05-19

申请号：US17524833

申请日：2021-11-12

Applicant: MPI Corporation

Inventor： Volker Hansel ,  Sebastian Giessmann ,  Frank Fehrmann ,  Chien-Hung Chen

IPC: G01R31/28

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.