公开(公告)号：US12099078B2

公开(公告)日：2024-09-24

申请号：US17856678

申请日：2022-07-01

Applicant: MPI Corporation

Inventor： Yi-Chien Tsai ,  Huo-Kang Hsu ,  Yu-Wen Chou ,  Yu-Shan Hu

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

公开(公告)号：US11839020B2

公开(公告)日：2023-12-05

申请号：US17701017

申请日：2022-03-22

Applicant: MPI CORPORATION

Inventor： Yu-Shan Hu ,  Yi-Lung Lee ,  Shao-Lun Wei ,  Yu-Wen Chou

IPC: H05K1/02 ,  G01R1/073 ,  H05K1/11

CPC classification number: H05K1/0251 ,  G01R1/07342 ,  H05K1/115 ,  H05K1/118

Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.

公开(公告)号：US20230065896A1

公开(公告)日：2023-03-02

申请号：US17856678

申请日：2022-07-01

Applicant: MPI Corporation

Inventor： Yi-Chien Tsai ,  Huo-Kang Hsu ,  Yu-Wen Chou ,  Yu-Shan Hu

IPC: G01R1/073

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.