公开(公告)号：US09526179B2

公开(公告)日：2016-12-20

申请号：US14635952

申请日：2015-03-02

Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.

Inventor： Chiu Yu Chen ,  Wen-Chin Lai ,  Pui-Ren Jiang ,  Hsu-Tung Chen

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/20

CPC classification number: H05K3/007 ,  H05K3/20 ,  H05K3/4691 ,  H05K2201/09509 ,  Y10T156/1039

Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括具有前侧和后侧的支撑板; 第一粘合剂层，其设置在所述支撑板的前侧; 以及嵌入到第一粘合剂层中的前线层。 前线层包括用于连接电子部件的至少一个外部接触部分，其中外部接触部分的表面与包围外部接触部分的第一粘合剂层的表面共面。