公开(公告)号：US20140353014A1

公开(公告)日：2014-12-04

申请号：US14295121

申请日：2014-06-03

Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.

Inventor： Wen-Chin Lai

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K3/4691 ,  H05K3/4611 ,  H05K2201/09127 ,  Y10T29/49165

Abstract: A combined circuit board including a flexible circuit board (FCB), a rigid circuit board (RCB), and first and second conductive vias (CVs) is provided. The FCB includes a flexible dielectric layer (DL) and a circuit layer (CL) disposed thereon. The RCB includes a rigid DL and a CL including a main circuit (MC) and an out connection interface circuit (OCIC). The rigid DL is disposed on the FCB and includes first and second rigid dielectric portions (RDPs) apart from each other by a distance such that part of the FCB is exposed outside. The MC and the OCIC are disposed on the first and the second RDPs, respectively. The first CV disposed in the second RDP electrically connects a contact of the OCIC and the CL of the FCB. The second CV disposed in the first RDP electrically connects the MC and the CL of the FCB.

Abstract translation: 提供了包括柔性电路板（FCB），刚性电路板（RCB）和第一和第二导电通孔（CV）的组合电路板。 FCB包括设置在其上的柔性介电层（DL）和电路层（CL）。 RCB包括刚性DL和包括主电路（MC）和输出连接接口电路（OCIC）的CL。 刚性DL设置在FCB上并且包括彼此分开一定距离的第一和第二刚性介质部分（RDP），使得FCB的一部分暴露在外部。 MC和OCIC分别设置在第一和第二RDP上。 设置在第二RDP中的第一个CV电连接OCIC的触点和FCB的CL。 设置在第一个RDP中的第二个CV将FC和FC的CL电连接。

公开(公告)号：US09526179B2

公开(公告)日：2016-12-20

申请号：US14635952

申请日：2015-03-02

Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.

Inventor： Chiu Yu Chen ,  Wen-Chin Lai ,  Pui-Ren Jiang ,  Hsu-Tung Chen

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/20

CPC classification number: H05K3/007 ,  H05K3/20 ,  H05K3/4691 ,  H05K2201/09509 ,  Y10T156/1039

Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括具有前侧和后侧的支撑板; 第一粘合剂层，其设置在所述支撑板的前侧; 以及嵌入到第一粘合剂层中的前线层。 前线层包括用于连接电子部件的至少一个外部接触部分，其中外部接触部分的表面与包围外部接触部分的第一粘合剂层的表面共面。