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公开(公告)号：US20250109499A1
公开(公告)日：2025-04-03
申请号：US18374804
申请日：2023-09-29
Applicant: MacDermid Enthone Inc.
Inventor： Aparna Iyer , Ernest Long , Kishore Viswanathan
Abstract: A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.
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