Low cost optical module
    1.
    发明授权
    Low cost optical module 有权
    低成本光模块

    公开(公告)号:US07093986B2

    公开(公告)日:2006-08-22

    申请号:US10772949

    申请日:2004-02-05

    IPC分类号: G02B6/42

    摘要: The present invention comprises an optical module, passively aligned and used in high-speed optical communication systems, having a ferrule disposed in an aperture in an upper plate of the module. The ferrule protrudes a predetermined distance through the aperture in order to guarantee butt coupling of an optical fibre to an active optical component disposed at a predetermined height on a lower plate of the module.

    摘要翻译: 本发明包括光学模块,被动对准并用于高速光通信系统中,其具有设置在模块的上板中的孔中的套圈。 套圈突出穿过孔的预定距离,以保证光纤与设置在模块的下板上的预定高度的有源光学部件的对接耦合。

    OPTOELECTRONIC TRANSISTOR OUTLINE (TO)-CAN HEADER ASSEMBLY HAVING A CONFIGURATION THAT IMPROVES HEAT DISSIPATION AND REDUCES THERMAL RESISTANCE
    6.
    发明申请
    OPTOELECTRONIC TRANSISTOR OUTLINE (TO)-CAN HEADER ASSEMBLY HAVING A CONFIGURATION THAT IMPROVES HEAT DISSIPATION AND REDUCES THERMAL RESISTANCE 审中-公开
    光电晶体管外形(TO) - 具有改进热耗散并降低耐热性的配置的组件

    公开(公告)号:US20110222567A1

    公开(公告)日:2011-09-15

    申请号:US12720043

    申请日:2010-03-09

    IPC分类号: H01S3/04

    摘要: A TO-can header assembly is provided that has improved heat dissipation and thermal resistance characteristics. The TO-can header assembly includes a relatively large ceramic heat dissipation block that functions as both a carrier for the laser diode and as a heat dissipation device. The ceramic heat dissipation block is in contact with the upper mounting surface of the header to allow a relatively large amount of heat to quickly pass from the laser diode through the heat dissipation block and into the upper mounting surface of the header. The cylindrical side wall of the header is smooth, rather than notched, and at least a substantial portion of the smooth cylindrical side wall is in continuous contact with an external heat sink device. Heat moves rapidly from the header into the external heat sink device where it is dissipated, thereby reducing the thermal resistance of the header.

    摘要翻译: 提供了具有改善的散热和热阻特性的TO-can头部组件。 TO-can头组件包括相对较大的陶瓷散热块,其作为激光二极管的载体和用作散热装置。 陶瓷散热块与集管的上部安装表面相接触,以允许相当大的热量从激光二极管快速通过散热块并进入集管的上部安装表面。 集管的圆柱形侧壁是平滑的,而不是切口,并且光滑圆柱形侧壁的至少大部分与外部散热装置连续接触。 热量从集管快速移动到散热装置中,从而降低了集管的热阻。