LIQUID COOLED COMPACT POWER SYSTEMS
    1.
    发明公开

    公开(公告)号:US20240203826A1

    公开(公告)日:2024-06-20

    申请号:US18413704

    申请日:2024-01-16

    摘要: An apparatus with a device having a metal structure, a metal element, a metal pedestal, and a transistor. Each of the metal structure, the metal element, and the metal pedestal may include first and second surfaces, which are substantially flat and opposite facing. The transistor may include first and second terminals, which may include first and second surfaces, respectively, that are substantially flat and opposite facing. The first surface of the metal pedestal may be electrically connected to the second surface of the metal element. The first and second surfaces of the first and second terminals, respectively, may be electrically connected to the first and second surfaces, respectively, of the metal structure and the metal pedestal, respectively. The second surface of the metal structure can be electrically and thermally connected to a bus bar.

    AIR COOLED COMPACT POWER SYSTEMS
    2.
    发明公开

    公开(公告)号:US20240251533A1

    公开(公告)日:2024-07-25

    申请号:US18419263

    申请日:2024-01-22

    IPC分类号: H05K7/20 H01L25/07 H01L25/16

    摘要: An apparatus with a bus bar, a heat-pipe, and device, which has a metal structure, a metal element, and a transistor. The metal structure may include first and second surfaces, that are flat and opposite facing. The metal element may include first and second surfaces that are flat and opposite facing. The transistor may include first and second terminals between which electrical current is transmitted when the transistor is activated. The first and second terminals may include first and second surfaces, respectively, that are substantially flat and opposite facing. The first and second surfaces of the first and second terminals, respectively, may be sintered to the first and second surfaces, respectively, of the metal structure and the metal element, respectively. The heat-pipe is thermally connected to the bus bar. The second surface of the metal structure is electrically and thermally connected to the bus bar.