公开(公告)号：US12027975B2

公开(公告)日：2024-07-02

申请号：US17191816

申请日：2021-03-04

申请人： Marel Power Solutions, Inc.

发明人： Jean-Claude Harel

IPC分类号： H02M3/156 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/00 ,  H02M7/53846 ,  H05K7/14 ,  H05K7/20

CPC分类号： H02M3/1563 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/003 ,  H02M7/538466 ,  H05K7/1432 ,  H05K7/209 ,  H02M1/327

摘要： A packaged power module includes a case, and a metal structure that has first and second surfaces. A transistor is also included that has first and second terminals between which current is transmitted when the transistor is activated, and a control terminal controlling the transistor, wherein the first terminal is sintered to the first surface. A first opening through the case exposes the second surface.

公开(公告)号：US20240348164A1

公开(公告)日：2024-10-17

申请号：US18751267

申请日：2024-06-23

申请人： Marel Power Solutions, Inc.

发明人： Jean-Claude Harel

IPC分类号： H02M3/156 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/00 ,  H02M7/53846 ,  H05K7/14 ,  H05K7/20

CPC分类号： H02M3/1563 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/003 ,  H02M7/538466 ,  H05K7/1432 ,  H05K7/209 ,  H02M1/327

摘要： An apparatus may include a first device having a first metal structure, a first metal element, and a first transistor. The first metal structure may include first and second surfaces, that are flat and opposite facing. The first metal element may include first and second surfaces that are flat and opposite facing. The first transistor may include first and second terminals between which 1 amp or more of electrical current is transmitted when the first transistor is activated, wherein the first and second terminals may include first and second surfaces, respectively, that are substantially flat and opposite facing. The second surface of the first metal structure can be electrically and thermally connected to a bus bar. The first and second surfaces of the first and second terminals, respectively, may be sintered to the first and second surfaces, respectively, of the first metal structure and the first metal element, respectively.

公开(公告)号：US20240203826A1

公开(公告)日：2024-06-20

申请号：US18413704

申请日：2024-01-16

申请人： Marel Power Solutions, Inc.

发明人： Ian Byers ,  Gary Miller ,  Stuart Wooters ,  Michael Grimes ,  Martin Baker

IPC分类号： H01L23/473 ,  H01L23/495 ,  H01L25/07 ,  H02M7/5395

CPC分类号： H01L23/473 ,  H01L23/49575 ,  H01L25/072 ,  H02M7/5395

摘要： An apparatus with a device having a metal structure, a metal element, a metal pedestal, and a transistor. Each of the metal structure, the metal element, and the metal pedestal may include first and second surfaces, which are substantially flat and opposite facing. The transistor may include first and second terminals, which may include first and second surfaces, respectively, that are substantially flat and opposite facing. The first surface of the metal pedestal may be electrically connected to the second surface of the metal element. The first and second surfaces of the first and second terminals, respectively, may be electrically connected to the first and second surfaces, respectively, of the metal structure and the metal pedestal, respectively. The second surface of the metal structure can be electrically and thermally connected to a bus bar.

公开(公告)号：US20230179110A1

公开(公告)日：2023-06-08

申请号：US17932366

申请日：2022-09-15

申请人： Marel Power Solutions, Inc.

发明人： Ian Byers ,  Gary Miller ,  Stuart Wooters ,  Jean-Claude Harel

IPC分类号： H02M7/00 ,  H05K7/20 ,  H02M7/537 ,  H01L23/495 ,  H05K1/18

CPC分类号： H02M7/003 ,  H05K7/209 ,  H02M7/537 ,  H01L23/49517 ,  H05K1/181 ,  H01L23/473

摘要： A device that includes a printed circuit board (PCB), a metal conductor, and a transistor. The metal conductor includes first and second oppositely facing surfaces. The transistor includes first and second terminals between which current is transmitted when the transistor is activated, and a gate terminal for controlling the transistor. The first terminal is sintered to the first surface, and the gate is electrically connected to a trace on the PCB.

公开(公告)号：US20240251533A1

公开(公告)日：2024-07-25

申请号：US18419263

申请日：2024-01-22

申请人： Marel Power Solutions, Inc.

发明人： Ian Byers ,  Stuart Wooters ,  Gary Miller ,  Michael Grimes ,  Martin Baker

IPC分类号： H05K7/20 ,  H01L25/07 ,  H01L25/16

CPC分类号： H05K7/20936 ,  H01L25/072 ,  H01L25/162 ,  H05K7/20909

摘要： An apparatus with a bus bar, a heat-pipe, and device, which has a metal structure, a metal element, and a transistor. The metal structure may include first and second surfaces, that are flat and opposite facing. The metal element may include first and second surfaces that are flat and opposite facing. The transistor may include first and second terminals between which electrical current is transmitted when the transistor is activated. The first and second terminals may include first and second surfaces, respectively, that are substantially flat and opposite facing. The first and second surfaces of the first and second terminals, respectively, may be sintered to the first and second surfaces, respectively, of the metal structure and the metal element, respectively. The heat-pipe is thermally connected to the bus bar. The second surface of the metal structure is electrically and thermally connected to the bus bar.

公开(公告)号：US11967899B2

公开(公告)日：2024-04-23

申请号：US17191805

申请日：2021-03-04

申请人： Marel Power Solutions, Inc.

发明人： Jean-Claude Harel

IPC分类号： H02M3/156 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/00 ,  H02M7/53846 ,  H05K7/14 ,  H05K7/20

CPC分类号： H02M3/1563 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/003 ,  H02M7/538466 ,  H05K7/1432 ,  H05K7/209 ,  H02M1/327

摘要： A compact inverter system includes a bus bar. The bus bar includes a terminal for connection to a positive terminal of a DC voltage supply. The compact inverter also includes a heat sink, a first transistor, and a second transistor. The first transistor has first and second terminals between which current is transmitted when the first transistor is activated, and a first gate terminal controlling the first transistor. The first terminal of the first transistor is thermally and electrically connected to the bus bar. The second transistor has first and second terminals between which current is transmitted when the second transistor is activated, and a second gate terminal controlling the second transistor. The first terminal of the second transistor is thermally and electrically connected to the heat sink. The first and second transistors are positioned between the bus bar and the heat sink. The first transistor is positioned between the second transistor and the bus bar. The second transistor is positioned between the first transistor and the heat sink.

公开(公告)号：US20230308026A1

公开(公告)日：2023-09-28

申请号：US17932369

申请日：2022-09-15

申请人： Marel Power Solutions, Inc.

发明人： Ian Byers ,  Gary Miller ,  Stuart Wooters

IPC分类号： H02M7/00 ,  H02M7/5395 ,  H02M1/08 ,  H02P27/08 ,  H05K7/20

CPC分类号： H02M7/003 ,  H02M7/5395 ,  H02M1/08 ,  H02P27/08 ,  H05K7/20936 ,  H05K7/20336 ,  H05K7/2039

摘要： A power converter that includes a bus bar, a transistor, and a heat-pipe. The transistor includes first and second terminals between which current is transmitted when the first transistor is activated, and a gate terminal for controlling the transistor. The terminal is thermally and electrically connected to the bus bar. The heat-pipe is thermally connected to the first bus bar.

公开(公告)号：US20210367516A1

公开(公告)日：2021-11-25

申请号：US17191805

申请日：2021-03-04

申请人： Marel Power Solutions, Inc.

发明人： Jean-Claude Harel

IPC分类号： H02M3/156 ,  H05K7/20 ,  H02M1/32 ,  H02K11/33

摘要： A compact inverter system includes a bus bar. The bus bar includes a terminal for connection to a positive terminal of a DC voltage supply. The compact inverter also includes a heat sink, a first transistor, and a second transistor. The first transistor has first and second terminals between which current is transmitted when the first transistor is activated, and a first gate terminal controlling the first transistor. The first terminal of the first transistor is thermally and electrically connected to the bus bar. The second transistor has first and second terminals between which current is transmitted when the second transistor is activated, and a second gate terminal controlling the second transistor. The first terminal of the second transistor is thermally and electrically connected to the heat sink. The first and second transistors are positioned between the bus bar and the heat sink. The first transistor is positioned between the second transistor and the bus bar. The second transistor is positioned between the first transistor and the heat sink.

公开(公告)号：US20210367526A1

公开(公告)日：2021-11-25

申请号：US17191816

申请日：2021-03-04

申请人： Marel Power Solutions, Inc.

发明人： Jean-Claude Harel

IPC分类号： H02M7/00 ,  H02M7/53846 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H05K7/14 ,  H01L21/50

摘要： A packaged power module includes a case, and a metal structure that has first and second surfaces. A transistor is also included that has first and second terminals between which current is transmitted when the transistor is activated, and a control terminal controlling the transistor, wherein the first terminal is sintered to the first surface. A first opening through the case exposes the second surface.