Modulation of complement to treat pain
    2.
    发明申请
    Modulation of complement to treat pain 审中-公开
    调理补体治疗疼痛

    公开(公告)号:US20050222027A1

    公开(公告)日:2005-10-06

    申请号:US10989891

    申请日:2004-11-12

    摘要: The present invention provides compositions and methods for treating pain, including neuropathic pain, by modulating the expression or activity of one or more components of the complement pathway. The present invention further provides screening methods to identify therapeutic agents for treating pain by screening for compounds capable of modulating the expression or activity of one or more components of the complement pathway.

    摘要翻译: 本发明提供了通过调节补体途径的一种或多种组分的表达或活性来治疗疼痛(包括神经性疼痛)的组合物和方法。 本发明进一步提供筛选方法,通过筛选能够调节补体途径的一种或多种成分的表达或活性的化合物来鉴定用于治疗疼痛的治疗剂。