Method of Etching a Material Surface
    1.
    发明申请
    Method of Etching a Material Surface 有权
    蚀刻材料表面的方法

    公开(公告)号:US20090305510A1

    公开(公告)日:2009-12-10

    申请号:US12134600

    申请日:2008-06-06

    IPC分类号: H01L21/3065

    摘要: Disclosed is a method of structuring a material surface by dry etching, so that a passivation layer soluble in a solvent forms by the dry etching on parts of the structured material surface, sealing the passivation layer with a substance soluble in the solvent, and removing the sealed passivation layer and the substance by means of the solvent.

    摘要翻译: 公开了通过干法蚀刻来构造材料表面的方法,从而通过在结构化材料表面的部分上的干蚀刻形成可溶于溶剂的钝化层,用可溶于溶剂的物质密封钝化层, 通过溶剂密封钝化层和物质。

    Method of etching a material surface
    2.
    发明授权
    Method of etching a material surface 有权
    蚀刻材料表面的方法

    公开(公告)号:US08183156B2

    公开(公告)日:2012-05-22

    申请号:US12134600

    申请日:2008-06-06

    IPC分类号: H01L21/302

    摘要: Disclosed is a method of structuring a material surface by dry etching, so that a passivation layer soluble in a solvent forms by the dry etching on parts of the structured material surface, sealing the passivation layer with a substance soluble in the solvent, and removing the sealed passivation layer and the substance by means of the solvent.

    摘要翻译: 公开了通过干法蚀刻来构造材料表面的方法,从而通过在结构化材料表面的部分上的干蚀刻形成可溶于溶剂的钝化层,用可溶于溶剂的物质密封钝化层, 通过溶剂密封钝化层和物质。